Packageless AlN/ZnO/Si Structure for SAW Devices Applications
- Legrani, Ouarda
- Elmazria, Omar
- Zhgoon, Sergei
- Pigeat, Philippe
- Bartasyte, Ausrine
Publication date
February 2013
DOI Publisher
Institute of Electrical and Electronics Engineers (IEEE) ISSN
1530-437XAbstract
Équipe 401 : Nanomatériaux pour la vie et développement durableInternational audienceThe possibility to perform a packageless structure for acoustic wave sensors applications based on AlN/interdigital transducer/ZnO/Si structure was investigated. The effect of thicknesses of AlN and ZnO thin films on structure performance was simulated by 2-D finite element method. Theoretical predictions were confirmed by in-situ measurements of frequency, insertion loss, and thickness during deposition of AlN layer on ZnO/Si
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