Add to ORKGhttp://deepblue.lib.umich.edu/bitstream/2027.42/21118/2/rl0998.0001.001.pdfhttp://deepblue.lib.umich.edu/bitstream/2027.42/21118/1/rl0998.0001.001.tx
The phase I program investigated the construction of electronic interconnections through the thickne...
In this paper, we present a compact 3-dimensional on-chip electromagnetic bandgap (EBG) structure wi...
We present an overview of a new monolithic fabrication technology known as three-dimensional integra...
http://deepblue.lib.umich.edu/bitstream/2027.42/21085/2/rl0947.0001.001.pdfhttp://deepblue.lib.umich...
This thesis presents several low-loss micromachined W-band circuit components suitable for integrati...
The device density of Integrated Circuits (ICs) manufactured by current VLSI technology is reaching ...
This thesis presents the measured performance of an integrated waveguide based on micromachined (001...
This thesis presents a variety of structures for high frequency applications utilizing silicon micro...
10.1088/0960-1317/22/11/113001Journal of Micromechanics and Microengineering2211-JMMI
In today’s technologies chips with higher degree of integration and functionality but yet smaller si...
This dissertation presents a comprehensive demonstration of the ability of membrane-supported transm...
International audienceEmerging millimeter-wave frequency applications require high performance, low-...
been developed for the fabrication of a new 3-D shared-memory test chip. This 3-D technology is base...
http://deepblue.lib.umich.edu/bitstream/2027.42/4156/5/bad3614.0001.001.pdfhttp://deepblue.lib.umich...
http://deepblue.lib.umich.edu/bitstream/2027.42/21100/2/rl0970.0001.001.pdfhttp://deepblue.lib.umich...
The phase I program investigated the construction of electronic interconnections through the thickne...
In this paper, we present a compact 3-dimensional on-chip electromagnetic bandgap (EBG) structure wi...
We present an overview of a new monolithic fabrication technology known as three-dimensional integra...
http://deepblue.lib.umich.edu/bitstream/2027.42/21085/2/rl0947.0001.001.pdfhttp://deepblue.lib.umich...
This thesis presents several low-loss micromachined W-band circuit components suitable for integrati...
The device density of Integrated Circuits (ICs) manufactured by current VLSI technology is reaching ...
This thesis presents the measured performance of an integrated waveguide based on micromachined (001...
This thesis presents a variety of structures for high frequency applications utilizing silicon micro...
10.1088/0960-1317/22/11/113001Journal of Micromechanics and Microengineering2211-JMMI
In today’s technologies chips with higher degree of integration and functionality but yet smaller si...
This dissertation presents a comprehensive demonstration of the ability of membrane-supported transm...
International audienceEmerging millimeter-wave frequency applications require high performance, low-...
been developed for the fabrication of a new 3-D shared-memory test chip. This 3-D technology is base...
http://deepblue.lib.umich.edu/bitstream/2027.42/4156/5/bad3614.0001.001.pdfhttp://deepblue.lib.umich...
http://deepblue.lib.umich.edu/bitstream/2027.42/21100/2/rl0970.0001.001.pdfhttp://deepblue.lib.umich...
The phase I program investigated the construction of electronic interconnections through the thickne...
In this paper, we present a compact 3-dimensional on-chip electromagnetic bandgap (EBG) structure wi...
We present an overview of a new monolithic fabrication technology known as three-dimensional integra...