We are entering the era of thermally-bound computing: Advanced and costly cooling solutions are needed to sustain the high computing densities of high-performance computing equipment. To reduce cooling costs and cooling overprovisioning, dynamic thermal management (DTM) strategies aim at controlling the device temperature by modulating online the performance of processing elements. While operating systems allow the migration of threads between cores, in HPC systems the threads of parallel applications are pinned to the allocated cores at start-time to avoid job-migration overheads. In this scenario state-of-the-art DTM solutions, which use thermal models to map jobs to cores, are based on long-term predictions to map the most critical job t...
Dynamic Thermal Management (DTM) techniques have been proposed to save on thermal packaging and cool...
The relentless increase of power density has rendered temperature a primary design constraint for mi...
Over the past decades, the shrinking transistor size enabled more transistors to be integrated into ...
International audienceAs side effects of the end of Dennard’s scaling, power and thermal technologic...
none3siopenCesarini, Daniele; Bartolini, Andrea; Benini, LucaCesarini, Daniele; Bartolini, Andrea; B...
Power has become a primary concern for HPC systems. Dynamic voltage and frequency scal-ing (DVFS) an...
With continuous IC(Integrated Circuit) technology size scaling, more and more transistors are integr...
With the advent of a new generation of supercomputers characterized by tightly-coupled integration o...
The power consumption of a high-end microprocessor increases very rapidly. High power consumption wi...
Abstract—With the high integration density and complexity of the modern multi-core platform, thermal...
In this paper we investigate and contrast two techniques to maximize the performance of multi-core p...
In this paper, we propose a proactive dynamic thermal management scheme for chip multiprocessors tha...
Power consumption and process variability are two important, interconnected, challenges of future ge...
In this paper, we propose a proactive dynamic thermal management scheme for chip multiprocessors tha...
The relentless increase of power density has rendered temperature a primary design constraint for mi...
Dynamic Thermal Management (DTM) techniques have been proposed to save on thermal packaging and cool...
The relentless increase of power density has rendered temperature a primary design constraint for mi...
Over the past decades, the shrinking transistor size enabled more transistors to be integrated into ...
International audienceAs side effects of the end of Dennard’s scaling, power and thermal technologic...
none3siopenCesarini, Daniele; Bartolini, Andrea; Benini, LucaCesarini, Daniele; Bartolini, Andrea; B...
Power has become a primary concern for HPC systems. Dynamic voltage and frequency scal-ing (DVFS) an...
With continuous IC(Integrated Circuit) technology size scaling, more and more transistors are integr...
With the advent of a new generation of supercomputers characterized by tightly-coupled integration o...
The power consumption of a high-end microprocessor increases very rapidly. High power consumption wi...
Abstract—With the high integration density and complexity of the modern multi-core platform, thermal...
In this paper we investigate and contrast two techniques to maximize the performance of multi-core p...
In this paper, we propose a proactive dynamic thermal management scheme for chip multiprocessors tha...
Power consumption and process variability are two important, interconnected, challenges of future ge...
In this paper, we propose a proactive dynamic thermal management scheme for chip multiprocessors tha...
The relentless increase of power density has rendered temperature a primary design constraint for mi...
Dynamic Thermal Management (DTM) techniques have been proposed to save on thermal packaging and cool...
The relentless increase of power density has rendered temperature a primary design constraint for mi...
Over the past decades, the shrinking transistor size enabled more transistors to be integrated into ...