Aufbau- und Löttechniken für die Montage von Festkörperlasern

For the first time all conditions for the assembly of all optical components of a laser system using soldering technology have been reviewed, evaluated and realized within the scope of this thesis using the example of a MicroSlab-Laser. One core element is a newly developed planar resistance-soldering process that allows for a successive soldering of the components on a common base plate. This patent pending process solves the problem of soldering planar components on a highly heat conductive plate component by component without influencing already soldered components. This is the key technology for miniaturized slab-lasers. In a systematic set of experiments it has been demonstrated that not only the properties of the solder material has an influence on the precision of the assembly. Stress induced deformation of the assembly in combination with an asymmetric wetting of the solder are crucial for achieving a high accuracy. A reduction of wetting asymmetry and the difference in thermal expansion coefficient of the mounting partners leads to a significant increase in mounting accuracy