The aim of this work is to gain a better understanding of the reactive sputtering process, with special emphasis on explanations from a microscopic point of view. Several steps were undertaken towards this end: An already existing deposition system was upgraded with new pressure gauges and a quadrupole mass analyzer to meet the new requirements for total and partial pressure determination. In consequence, it was possible to switch from the macroscopic parameter pressure to the average number of collisions. Thin films of zinc oxide and silver were deposited, and their properties were studied. These could be modified in two distinct ways: First, this was done by variation of the deposition conditions. This concept was applied to the depositio...
The complexity of the reactive magnetron sputtering process is demonstrated by four simulation examp...
The sputter yield and discharge voltage of fourteen target materials (Al, Cr, Cu, Mg, Mo, Nb, Pb, Ta...
The complexity of the reactive magnetron sputtering process is demonstrated by four simulation examp...
This thesis covers the stress evolution in thin sputtered metal and oxide films. To achieve this, a ...
This thesis covers the stress evolution in thin sputtered metal and oxide films. To achieve this, a ...
Sputtering is a physical vapor deposition (PVD) process used to create thin films, i.e very thin lay...
Thin Film deposition is a process that has been around since the beginning of the twentieth century ...
As a novel metal oxide material with promising electrical properties, CoZrTaOx (OCZT) requires preci...
This work seeks an atomistic understanding of fundamental processes in DC reactive magnetron sputter...
We present a method to eliminate hysteresis effects and to increase the deposition rate for the reac...
The work presented in this thesis deals with reactive magnetron sputtering processes of metal oxides...
The work presented in this thesis deals with reactive magnetron sputtering processes of metal oxides...
n ultra-high-vacuum-compatible direct current ion beam sputter source is used to deposit strongly de...
Reactive sputtering is a complex process involving different parameters for control The reactive gas...
Reactive sputtering is a complex process involving different parameters for control The reactive gas...
The complexity of the reactive magnetron sputtering process is demonstrated by four simulation examp...
The sputter yield and discharge voltage of fourteen target materials (Al, Cr, Cu, Mg, Mo, Nb, Pb, Ta...
The complexity of the reactive magnetron sputtering process is demonstrated by four simulation examp...
This thesis covers the stress evolution in thin sputtered metal and oxide films. To achieve this, a ...
This thesis covers the stress evolution in thin sputtered metal and oxide films. To achieve this, a ...
Sputtering is a physical vapor deposition (PVD) process used to create thin films, i.e very thin lay...
Thin Film deposition is a process that has been around since the beginning of the twentieth century ...
As a novel metal oxide material with promising electrical properties, CoZrTaOx (OCZT) requires preci...
This work seeks an atomistic understanding of fundamental processes in DC reactive magnetron sputter...
We present a method to eliminate hysteresis effects and to increase the deposition rate for the reac...
The work presented in this thesis deals with reactive magnetron sputtering processes of metal oxides...
The work presented in this thesis deals with reactive magnetron sputtering processes of metal oxides...
n ultra-high-vacuum-compatible direct current ion beam sputter source is used to deposit strongly de...
Reactive sputtering is a complex process involving different parameters for control The reactive gas...
Reactive sputtering is a complex process involving different parameters for control The reactive gas...
The complexity of the reactive magnetron sputtering process is demonstrated by four simulation examp...
The sputter yield and discharge voltage of fourteen target materials (Al, Cr, Cu, Mg, Mo, Nb, Pb, Ta...
The complexity of the reactive magnetron sputtering process is demonstrated by four simulation examp...