Multi-pixel, 4. 5 × 9 μm, plasmonic colour filters, consisting of periodic subwavelength holes in an aluminium film, were directly integrated on the top surface of a complementary metal oxide semiconductor (CMOS) image sensor (CIS) using electron beam lithography and dry etch. The 100 × 100-pixel plasmonic CIS showed full colour sensitivities across the visible range determined by a photocurrent measurement. The filters were fabricated in a simple process utilising a single lithography step. This is to be compared with the traditional multi-step processing when using dye-doped polymers. The intrinsic compatibility of these plasmonic components with a standard CMOS process allows them to be manufactured in a metal layer close to the photodio...
A CMOS image sensor that employs a vertically integrated double junction photodiode structure is pre...
High pixel density, efficient color splitting, a compact structure, superior quantum efficiency, and...
Following the trend of increased integration in complementary metal oxide semiconductor (CMOS) image...
A single-pixel plasmonic complementary metal oxide semiconductor (CMOS) photo sensor consisting of a...
We present the design, implementation and test of a CMOS image sensor filter technology based on the...
Imaging resolution of complementary metal oxide semiconductor (CMOS) image sensor (CIS) keeps increa...
Significant improvement in using plasmonic nanostructures for practical colour filtering and multisp...
Currently, image sensors are hybrid devices, combining semiconductor photodiodes with off-chip color...
Photodetector size imposes a fundamental limit on the amount of information that can be recorded by ...
Silicon based photodiodes provide spectral response in the visible wavelength range (VIS) but also i...
State-of-the-art CMOS imagers are composed of very small pixels, so it is critical for plasmonic ima...
In this thesis two methods for the manufacturing of optical elements for the monolithic integration ...
Plasmonic filters, with spectral responses matching the 1931 International Commission on Illuminatio...
The pixel size imposes a fundamental limit on the amount of information that can be displayed or rec...
The light sensors market is growing, driven largely by increased use of proximity detection and ambi...
A CMOS image sensor that employs a vertically integrated double junction photodiode structure is pre...
High pixel density, efficient color splitting, a compact structure, superior quantum efficiency, and...
Following the trend of increased integration in complementary metal oxide semiconductor (CMOS) image...
A single-pixel plasmonic complementary metal oxide semiconductor (CMOS) photo sensor consisting of a...
We present the design, implementation and test of a CMOS image sensor filter technology based on the...
Imaging resolution of complementary metal oxide semiconductor (CMOS) image sensor (CIS) keeps increa...
Significant improvement in using plasmonic nanostructures for practical colour filtering and multisp...
Currently, image sensors are hybrid devices, combining semiconductor photodiodes with off-chip color...
Photodetector size imposes a fundamental limit on the amount of information that can be recorded by ...
Silicon based photodiodes provide spectral response in the visible wavelength range (VIS) but also i...
State-of-the-art CMOS imagers are composed of very small pixels, so it is critical for plasmonic ima...
In this thesis two methods for the manufacturing of optical elements for the monolithic integration ...
Plasmonic filters, with spectral responses matching the 1931 International Commission on Illuminatio...
The pixel size imposes a fundamental limit on the amount of information that can be displayed or rec...
The light sensors market is growing, driven largely by increased use of proximity detection and ambi...
A CMOS image sensor that employs a vertically integrated double junction photodiode structure is pre...
High pixel density, efficient color splitting, a compact structure, superior quantum efficiency, and...
Following the trend of increased integration in complementary metal oxide semiconductor (CMOS) image...