In this work, the process parameters involved in the electrophoretic deposition (EPD) to obtain thin TiN films was studied and optimised. The stability of commercial TiN nanopowder in isopropyl alcohol adding a cationic polymer (polyethylenimine) as dispersant, with different molecular weights, was investigated to determine the kinetics of the deposition and to reach the most efficient EPD process. Cathodic EPD was performed over electro-polished stainless steel substrates. It was found that the provided dispersion when the PEI with the highest molecular weight was added to the suspension, leads to the best deposition behaviour for short times. New flocculation phenomena were described which affect to the sticking factor, and thus to the ev...
AbstractIn this study, seed layer free electrochemical plating deposition (SLF-EPD) for Ag on ALD-Ti...
Large surface area, homogenous, and adhesive TiO2 coatings on stainless steel substrates were prepar...
A novel low temperature process for titanium nitride (TiN) deposition by means of an electron cyclot...
In this work, the process parameters involved in the electrophoretic deposition (EPD) to obtain thin...
In this work the stability of TiN and TiC nanopowders in isopropyl alcohol as well as the fabricatio...
The parameters that control the stability of ZnO-nanoparticles suspensions and their deposition by e...
International audienceAluminum (Al) coatings were deposited on 15CDV6 steel substrates using the ele...
Submicron tin oxide (SnO2) was obtained from thermal decomposition of tin oxalate (SnC2O4) precipita...
The mechanism of nucleation and growth of tin electrodeposits was investigated. Also the influences...
Understanding the colloidal behavior of particles is mandatory to prepare stable and disperse suspen...
This report explores the possibilities of the usage of EPD (electrophoretic deposition) process for ...
This study was a preliminary study in applying chitosan as coating for tinplate. Tinplate is used as...
The present paper describes the immobilization of nanoparticles onto conducting substrates by using ...
Electrophoretic deposition (EPD) is attracting increasing interest as a materials processing techniq...
Understanding the colloidal behavior of particles is mandatory to prepare stable and disperse suspen...
AbstractIn this study, seed layer free electrochemical plating deposition (SLF-EPD) for Ag on ALD-Ti...
Large surface area, homogenous, and adhesive TiO2 coatings on stainless steel substrates were prepar...
A novel low temperature process for titanium nitride (TiN) deposition by means of an electron cyclot...
In this work, the process parameters involved in the electrophoretic deposition (EPD) to obtain thin...
In this work the stability of TiN and TiC nanopowders in isopropyl alcohol as well as the fabricatio...
The parameters that control the stability of ZnO-nanoparticles suspensions and their deposition by e...
International audienceAluminum (Al) coatings were deposited on 15CDV6 steel substrates using the ele...
Submicron tin oxide (SnO2) was obtained from thermal decomposition of tin oxalate (SnC2O4) precipita...
The mechanism of nucleation and growth of tin electrodeposits was investigated. Also the influences...
Understanding the colloidal behavior of particles is mandatory to prepare stable and disperse suspen...
This report explores the possibilities of the usage of EPD (electrophoretic deposition) process for ...
This study was a preliminary study in applying chitosan as coating for tinplate. Tinplate is used as...
The present paper describes the immobilization of nanoparticles onto conducting substrates by using ...
Electrophoretic deposition (EPD) is attracting increasing interest as a materials processing techniq...
Understanding the colloidal behavior of particles is mandatory to prepare stable and disperse suspen...
AbstractIn this study, seed layer free electrochemical plating deposition (SLF-EPD) for Ag on ALD-Ti...
Large surface area, homogenous, and adhesive TiO2 coatings on stainless steel substrates were prepar...
A novel low temperature process for titanium nitride (TiN) deposition by means of an electron cyclot...