Add to ORKGIn this paper, we present an on-die post-silicon binning methodology that takes into account the effect of static and dynamic variations and categorizes every processor based on power/performance.The proposed scheme is composed of a discretization hardware that exploits the delay/leakage dependence on variability sources characteristic for categorizatio
The continued scaling of digital integrated circuits has led to an increasingly larger impact of pro...
Abstract—The ever-increasing chip power dissipation in SoCs has imposed great challenges on today’s ...
In nanometer technology regime, process variation (PV) causes uncertainties in the processor frequen...
Abstract—Variation-aware design involves designing circuits tolerant to process and temperature vari...
With scaling of semiconductor fabrication technologies and the push towards deep sub-micron technolo...
AbstractNumber of cores per multi-core processor die, as well as variation between the maximum opera...
The significant process parameter variations occurring during fabrication of high performance sequen...
As integrated-circuit technology continues to scale, process variation is becoming an issue that can...
142 p.Thesis (Ph.D.)--University of Illinois at Urbana-Champaign, 2007.Using this model we introduce...
Within-die variation in leakage power consumption is sub-stantial and increasing for chip-level mult...
This paper proposes microarchitecture-level models for Within Die (WID) process and system parameter...
As transistor feature sizes continue to shrink into the sub-90nm range and beyond, the effects of pr...
Shrinking of device dimensions has undoubtedly enabled the very large scale integration of transisto...
As the CMOS technology continues to scale down for higher performance, power dissipation and robustn...
In this thesis, we have investigated the impact of parametric variations on the behaviour of one per...
The continued scaling of digital integrated circuits has led to an increasingly larger impact of pro...
Abstract—The ever-increasing chip power dissipation in SoCs has imposed great challenges on today’s ...
In nanometer technology regime, process variation (PV) causes uncertainties in the processor frequen...
Abstract—Variation-aware design involves designing circuits tolerant to process and temperature vari...
With scaling of semiconductor fabrication technologies and the push towards deep sub-micron technolo...
AbstractNumber of cores per multi-core processor die, as well as variation between the maximum opera...
The significant process parameter variations occurring during fabrication of high performance sequen...
As integrated-circuit technology continues to scale, process variation is becoming an issue that can...
142 p.Thesis (Ph.D.)--University of Illinois at Urbana-Champaign, 2007.Using this model we introduce...
Within-die variation in leakage power consumption is sub-stantial and increasing for chip-level mult...
This paper proposes microarchitecture-level models for Within Die (WID) process and system parameter...
As transistor feature sizes continue to shrink into the sub-90nm range and beyond, the effects of pr...
Shrinking of device dimensions has undoubtedly enabled the very large scale integration of transisto...
As the CMOS technology continues to scale down for higher performance, power dissipation and robustn...
In this thesis, we have investigated the impact of parametric variations on the behaviour of one per...
The continued scaling of digital integrated circuits has led to an increasingly larger impact of pro...
Abstract—The ever-increasing chip power dissipation in SoCs has imposed great challenges on today’s ...
In nanometer technology regime, process variation (PV) causes uncertainties in the processor frequen...