Interfacial study of polyimide/copper system using silane-modified polyvinylimidazoles as adhesion promoters

Polyvinylimidazoles(PVIs) modi®ed with vinyltrimethoxysilane (VTS) in different mole ratios were applied as adhesion promoters for polyimide (PI)/copper interface. The effects of the composition of VTS-modi®ed PVI copolymers on lap shear strengths between PI and copper were investigated at different bonding temperatures. Fourier transform infrared spectroscopy was applied to examine the thermooxidative degradation of PI and oxidation of copper. In addition, scanning electron microscope and contact angle measurement analysis were performed to investigate the compatibility of VTS-modi®ed PVIs with PI. An improvement in interfacial adhesion strength was obtained using the adhesion promoters. Especially at higher bonding temperatures, a signi®cant increment in lap shear strength was seen when the mole ratio (VI:VTS) was 3:7, due to the high thermal stability of the silane unit. However, at lower bonding temperatures, lap shear strength does not increase as above, owing to the poor compatibility between the VTS-modi®ed PVI with PI. q 2001 Elsevier Science Ltd. All rights reserved.This research has been carried out by Research Institute of Engineering Science (RIES) and the authors gratefully acknowledge the research support of RIES