The aim of the project is to suppress hydrogen evolution by co-depositing tin in nickel electrodeposition system. Concentration of tin was varied to investigate the hydrogen suppression effects by tin co-deposition; however it was discovered that tin ions will form oxides which are insoluble. Adding MSA and HQ will inhibit tin oxides formation, thus ensuring availability of tin ions for deposition. At tin-nickel concentration of 1:1000, it was observed that hydrogen bubbles took a longer time to form than a tin-free deposition, thus suggesting that co-depositing tin was able to suppress hydrogen evolution. However at tin-nickel concentration of 1:100, non-adherent deposits were observed which lead to inability to determine the hydrogen supp...
The ban on lead in electronic industry caused manufacturers to search for alternative ways to replac...
The industrial process of the electrowinning of nickel requires strict control of the quality of the...
The influence of a perfluorinated, cationic surfactant on the electrodeposition of tin onto a copper...
Tin electrodeposition applications have rapidly evolved in the past 25 years. Usage of tin coatings ...
[[abstract]]©2001 NASF - Tin/lead alloy electrodeposition within methane sulfonic acid (MSA) solutio...
High-rate electroplating of tin on a moving steel strip is generally carried out in cells with dimen...
The purpose of these studies is to obtain a better understanding of the role which antimony plays in...
Tin is widely used in solder, tin plating and tin alloys. The current recovery rate of tin metal is ...
Abstract: The efects of additives on the stannous reduction of an acid sulfate bath were investigate...
Since the use of the most stable Pb-based materials in the electronic industry has been banned due t...
The electrodeposition of tin, at a copper surface, from a tin sulphate (0˙014 mol dm–3) electrolyte ...
It is widely documented that whisker growth is more rapid for tin deposits on brass compared with de...
For years, the alloy of choice for electroplating electronic components has been tin-lead (Sn-Pb) al...
The mechanism of nucleation and growth of tin electrodeposits was investigated. Also the influences...
The importance of tin and its electrodeposition are summarised and the scope for plating tin is outl...
The ban on lead in electronic industry caused manufacturers to search for alternative ways to replac...
The industrial process of the electrowinning of nickel requires strict control of the quality of the...
The influence of a perfluorinated, cationic surfactant on the electrodeposition of tin onto a copper...
Tin electrodeposition applications have rapidly evolved in the past 25 years. Usage of tin coatings ...
[[abstract]]©2001 NASF - Tin/lead alloy electrodeposition within methane sulfonic acid (MSA) solutio...
High-rate electroplating of tin on a moving steel strip is generally carried out in cells with dimen...
The purpose of these studies is to obtain a better understanding of the role which antimony plays in...
Tin is widely used in solder, tin plating and tin alloys. The current recovery rate of tin metal is ...
Abstract: The efects of additives on the stannous reduction of an acid sulfate bath were investigate...
Since the use of the most stable Pb-based materials in the electronic industry has been banned due t...
The electrodeposition of tin, at a copper surface, from a tin sulphate (0˙014 mol dm–3) electrolyte ...
It is widely documented that whisker growth is more rapid for tin deposits on brass compared with de...
For years, the alloy of choice for electroplating electronic components has been tin-lead (Sn-Pb) al...
The mechanism of nucleation and growth of tin electrodeposits was investigated. Also the influences...
The importance of tin and its electrodeposition are summarised and the scope for plating tin is outl...
The ban on lead in electronic industry caused manufacturers to search for alternative ways to replac...
The industrial process of the electrowinning of nickel requires strict control of the quality of the...
The influence of a perfluorinated, cationic surfactant on the electrodeposition of tin onto a copper...