Microelectronic test structures are used for wide variety of tasks which include equipment characterizations, reliability evaluations, defect monitoring, transistor parameter extraction and process verification and development. Similarly, test structures are used in electromigration evaluation. In this dissertation, the various common test structures used in electromigration test were reviewed. The structures’ application, advantages and disadvantages were discussed.Master of Science (Microelectronics
In this work the applicability of NIST electromigration test patterns when used to test “bamboo” met...
The effects of premetalization cleaning on electromigration in Al-Si thin films was studied. Premeta...
This project studies copper electromigration reliability with the help of engineers of Chartered Sem...
Electromigration tests have been performed on a number of test structures with different geometries ...
The electromigration phenomenon has been one of the most intriguing physical problems in the semicon...
The design of a novel test structure to study the influence of electromigration and thermomigration ...
An electromigration (EM) test mask was designed to utilize both standard ASTM and Standard Wafer-lev...
As VLSI chip sizes and packing densities continue to escalate, electromigration failures have become...
This work is aimed at proposing a standard procedure for moderately accelerated Electromigration (EM...
Through Silicon Via (TSV) is a hot topic in today’s 3D Integrated Circuit. In order for TSV to be us...
The steady state and transient thermal behavior of an electromigration test structure was analyzed. ...
In this paper, the isothermal wafer-level electromigration test method has been used to compare the ...
The focus of this study is to compare the electromigration reliability of W-plug and Al-via in deep ...
Due to decreasing dimensions, electromigration becomes a major concern for flip chip joint reliabili...
Further miniaturization of electronic systems is approaching new limits due to the failure mechanism...
In this work the applicability of NIST electromigration test patterns when used to test “bamboo” met...
The effects of premetalization cleaning on electromigration in Al-Si thin films was studied. Premeta...
This project studies copper electromigration reliability with the help of engineers of Chartered Sem...
Electromigration tests have been performed on a number of test structures with different geometries ...
The electromigration phenomenon has been one of the most intriguing physical problems in the semicon...
The design of a novel test structure to study the influence of electromigration and thermomigration ...
An electromigration (EM) test mask was designed to utilize both standard ASTM and Standard Wafer-lev...
As VLSI chip sizes and packing densities continue to escalate, electromigration failures have become...
This work is aimed at proposing a standard procedure for moderately accelerated Electromigration (EM...
Through Silicon Via (TSV) is a hot topic in today’s 3D Integrated Circuit. In order for TSV to be us...
The steady state and transient thermal behavior of an electromigration test structure was analyzed. ...
In this paper, the isothermal wafer-level electromigration test method has been used to compare the ...
The focus of this study is to compare the electromigration reliability of W-plug and Al-via in deep ...
Due to decreasing dimensions, electromigration becomes a major concern for flip chip joint reliabili...
Further miniaturization of electronic systems is approaching new limits due to the failure mechanism...
In this work the applicability of NIST electromigration test patterns when used to test “bamboo” met...
The effects of premetalization cleaning on electromigration in Al-Si thin films was studied. Premeta...
This project studies copper electromigration reliability with the help of engineers of Chartered Sem...