Add to ORKGIn the current semiconductor industry, the technology of semiconductor is more advanced and the size of device get more and more small, as described by the Moore’s Law. To realize the chip fully integration, it will be an excellent choice to use bond-wire which has high quality factor, large cost reduction and power efficiency. Our research group is working on high-frequency fully integrated switched-mode DC-DC converters. However, due to the small diameter and length of the bond-wire, the inductance may be too small and cannot meet the requirement in high-frequency fully integrated switched-mode DC-DC converters. This Master of engineering dissertation project pertains to the work of modeling, designing and realizing high quality factor ...
Three problems dealing with the modeling of wires in integrated circuits are considered: (i) fast an...
For the successful electrical design of system-inpackage, this paper proposes an efficient method fo...
This electronic version was submitted by the student author. The certified thesis is available in th...
Wire bond technology is a matured and dominant interconnect methodology compared to other chip inter...
Switched Mode DC-DC Converters (SMCs) are required for portable devices to achieve high power-effici...
Novel analytical models for accurately and efficiently calculating the inductances of bond wires in ...
An on-chip inductor is proposed for the application of designing a fully integrated DCDC converter. ...
The concept of coupled multiturn bondwire inductors with ferrite epoxy glob cores is investigated bo...
Bonding wires are extensively used in integrated circuit (IC) packaging and circuit design in RF app...
A novel approach for electrical modeling of multiple coupled wire bonds up to a frequency of 10GHz i...
This dissertation pertains to the design of on-chip inductors for high-frequency fullyintegrated DC...
In this paper, a novel analytical model for calculating the partial self-inductance of bond wires in...
This paper proposes 3D field simulation models for different designs of integrated bond wire on-chip...
The concept of coupled multiturn bondwire inductors with ferrite epoxy glob cores is investigated bo...
In this contribution, the authors present a systematic approach for optimizing the RF performance of...
Three problems dealing with the modeling of wires in integrated circuits are considered: (i) fast an...
For the successful electrical design of system-inpackage, this paper proposes an efficient method fo...
This electronic version was submitted by the student author. The certified thesis is available in th...
Wire bond technology is a matured and dominant interconnect methodology compared to other chip inter...
Switched Mode DC-DC Converters (SMCs) are required for portable devices to achieve high power-effici...
Novel analytical models for accurately and efficiently calculating the inductances of bond wires in ...
An on-chip inductor is proposed for the application of designing a fully integrated DCDC converter. ...
The concept of coupled multiturn bondwire inductors with ferrite epoxy glob cores is investigated bo...
Bonding wires are extensively used in integrated circuit (IC) packaging and circuit design in RF app...
A novel approach for electrical modeling of multiple coupled wire bonds up to a frequency of 10GHz i...
This dissertation pertains to the design of on-chip inductors for high-frequency fullyintegrated DC...
In this paper, a novel analytical model for calculating the partial self-inductance of bond wires in...
This paper proposes 3D field simulation models for different designs of integrated bond wire on-chip...
The concept of coupled multiturn bondwire inductors with ferrite epoxy glob cores is investigated bo...
In this contribution, the authors present a systematic approach for optimizing the RF performance of...
Three problems dealing with the modeling of wires in integrated circuits are considered: (i) fast an...
For the successful electrical design of system-inpackage, this paper proposes an efficient method fo...
This electronic version was submitted by the student author. The certified thesis is available in th...