Atomic layer deposition (ALD) of ZrO2 on native oxide covered (untreated) and buffered oxide etchant (BOE) treated AlGaN surface was analyzed by utilizing x-ray photoelectron spectroscopy (XPS) and high-resolution transmission electron microscopy. Evidenced by Ga–O and Al–O chemical bonds by XPS, parasitic oxidation during deposition is largely enhanced on BOE treated AlGaN surface. Due to the high reactivity of Al atoms, more prominent oxidation of Al atoms is observed, which leads to thicker interfacial layer formed on BOE treated surface. The results suggest that native oxide on AlGaN surface may serve as a protecting layer to inhibit the surface from further parasitic oxidation during ALD. The findings provide important process guidelin...
International audienceControlling the plasma etching step involved in metal-oxide-semiconductor high...
The surface chemical properties of AlxGa1-xN (x=0.35, 0.47, 0.60) epi-layers grown on c-plane sapphi...
International audienceControlling the plasma etching step involved in metal-oxide-semiconductor high...
The effect of post-deposition annealing on chemical bonding states at interface between Al0.5Ga0.5N ...
The interface region between Ga-face n-type GaN and Al2O3 dielectric (achieved via atomic-layer depo...
Surface cleaning of gallium nitride (GaN) prior to atomic layer deposition (ALD) of aluminum oxide w...
The interfacial chemistry of n-type Ga-face GaN during atomic layer deposition of Al2O3 is studied b...
The interfacial chemistry of n-type Ga-face GaN during atomic layer deposition of Al2O3 is studied b...
We demonstrate the applicability of atomic layer deposition of Al2O3 and ZrO2 on InAlN/GaN-materials...
In this study, conventional multiple-frequency capacitance–voltage (C-V) curves of a metal-insulator...
International audienceIn this work, the Al2O3/GaSb interface has been studied by x-ray photoelectron...
The chemistry of oxygen atoms at the surface of an AlGaN layer for Al 0.35Ga0.65N/GaN heterostructur...
International audienceControlling the plasma etching step involved in metal-oxide-semiconductor high...
The interface electronic structures of GaN and GaN/AlGaN/GaN samples, capped with atomic-layer-depos...
The surface chemical properties of AlxGa1-xN (x=0.35, 0.47, 0.60) epi-layers grown on c-plane sapphi...
International audienceControlling the plasma etching step involved in metal-oxide-semiconductor high...
The surface chemical properties of AlxGa1-xN (x=0.35, 0.47, 0.60) epi-layers grown on c-plane sapphi...
International audienceControlling the plasma etching step involved in metal-oxide-semiconductor high...
The effect of post-deposition annealing on chemical bonding states at interface between Al0.5Ga0.5N ...
The interface region between Ga-face n-type GaN and Al2O3 dielectric (achieved via atomic-layer depo...
Surface cleaning of gallium nitride (GaN) prior to atomic layer deposition (ALD) of aluminum oxide w...
The interfacial chemistry of n-type Ga-face GaN during atomic layer deposition of Al2O3 is studied b...
The interfacial chemistry of n-type Ga-face GaN during atomic layer deposition of Al2O3 is studied b...
We demonstrate the applicability of atomic layer deposition of Al2O3 and ZrO2 on InAlN/GaN-materials...
In this study, conventional multiple-frequency capacitance–voltage (C-V) curves of a metal-insulator...
International audienceIn this work, the Al2O3/GaSb interface has been studied by x-ray photoelectron...
The chemistry of oxygen atoms at the surface of an AlGaN layer for Al 0.35Ga0.65N/GaN heterostructur...
International audienceControlling the plasma etching step involved in metal-oxide-semiconductor high...
The interface electronic structures of GaN and GaN/AlGaN/GaN samples, capped with atomic-layer-depos...
The surface chemical properties of AlxGa1-xN (x=0.35, 0.47, 0.60) epi-layers grown on c-plane sapphi...
International audienceControlling the plasma etching step involved in metal-oxide-semiconductor high...
The surface chemical properties of AlxGa1-xN (x=0.35, 0.47, 0.60) epi-layers grown on c-plane sapphi...
International audienceControlling the plasma etching step involved in metal-oxide-semiconductor high...