Add to ORKGThe stress and strain behaviour of surface-mounted electronic packaging components under temperature cycling fatigue and creep deformations was investigated by non-linear three dimensional finite element method. In this research, solder joints of a PQFP package with a corner lead and solder joints of a CBGA package were studied.Master of Engineering (MPE
[[abstract]]As the interconnection density of electronic packaging continues to increase, the fatigu...
Interfacial stress due to thermal mismatch in layered structure has been considered as one of the ma...
equivalent beam can be obtained by optimization iteration and reduce the time-to-market in the elect...
The stress and strain behaviour of surface-mounted electronic packaging components under temperature...
This study examines the cyclic stress-strain response of solder joints in a surface mounted electron...
62 p.A programme written by Robert Darveaux was downloaded and run using ANSYS™ 5.3 in this project ...
Surface mounted microelectronic (SMT) consist of components and packages mounted on printed circuit ...
62 p.A programme written by Robert Darveaux was downloaded and run using ANSYS™ 5.3 in this project ...
The paper presents the study of non-uniform temperature distributions in a flip chip electronic asse...
Interfacial stress due to thermal mismatch in layered structure has been considered as one of the ma...
Surface mount technology is quite common in modern electronics industry. In some instances, printed...
Interfacial stress due to thermal mismatch in layered structure has been considered as one of the ma...
[[abstract]]The thermally enhanced ball grid array (TEBGA) electronic packaging under thermal cyclin...
[[abstract]]The thermally enhanced ball grid array (TEBGA) electronic packaging under thermal cyclin...
Electronic chip packages are comprised of several components with different material properties and ...
[[abstract]]As the interconnection density of electronic packaging continues to increase, the fatigu...
Interfacial stress due to thermal mismatch in layered structure has been considered as one of the ma...
equivalent beam can be obtained by optimization iteration and reduce the time-to-market in the elect...
The stress and strain behaviour of surface-mounted electronic packaging components under temperature...
This study examines the cyclic stress-strain response of solder joints in a surface mounted electron...
62 p.A programme written by Robert Darveaux was downloaded and run using ANSYS™ 5.3 in this project ...
Surface mounted microelectronic (SMT) consist of components and packages mounted on printed circuit ...
62 p.A programme written by Robert Darveaux was downloaded and run using ANSYS™ 5.3 in this project ...
The paper presents the study of non-uniform temperature distributions in a flip chip electronic asse...
Interfacial stress due to thermal mismatch in layered structure has been considered as one of the ma...
Surface mount technology is quite common in modern electronics industry. In some instances, printed...
Interfacial stress due to thermal mismatch in layered structure has been considered as one of the ma...
[[abstract]]The thermally enhanced ball grid array (TEBGA) electronic packaging under thermal cyclin...
[[abstract]]The thermally enhanced ball grid array (TEBGA) electronic packaging under thermal cyclin...
Electronic chip packages are comprised of several components with different material properties and ...
[[abstract]]As the interconnection density of electronic packaging continues to increase, the fatigu...
Interfacial stress due to thermal mismatch in layered structure has been considered as one of the ma...
equivalent beam can be obtained by optimization iteration and reduce the time-to-market in the elect...