The effect of ion implantation on the behavior and extent of layer inversion in Ni-silicided poly-Si was investigated. Two different implantation species, namely, BF2 + and N2+ , which affect the poly-Si grain growth were used. Retarded layer inversion was found with the ion-implanted poly-Si substrates. However, the formation of NiSi2 takes place at 700°C, which is slightly lower than that on Si(100). The easy nucleation of NiSi2 on poly-Si is implicitly related to the morphology perturbation.Published versio
An unusual Ni distribution with two completely separated buried and surface silicide layers has been...
We present a systematic study on the effects of CF4 plasma immersion ion implantation (PIII) in Si o...
Nickel silicide formation during the annealing of very high dose (≥4.5 x 10^17 ions/cm^2) Si i...
The effect of ion implantation on the behavior and extent of layer inversion in Ni-silicided poly-Si...
The phase and morphology stability of NiSi and Ni(Pt)Si formed on the poly-Si lines and wide pads ha...
The key feature of this study is to incorporate N2 + implant prior to Ni sputtering on the poly-Si g...
The grain boundaries which included dangling bonds in Ni-metal-induced lateral crystallization (NILC...
An unusual Ni distribution with two completely separated buried and surface silicide layers has been...
The issue of agglomeration and layer inversion has remained critical because conductivity of thin si...
The issue of agglomeration and layer inversion has remained critical because conductivity of thin si...
Nickel (Ni) Metal-Induced-Lateral-Crystallization (MILC) of amorphous Si is a promising technology f...
The formation and distribution of NiSi2 in (111) silicon by Ni-ion implantation with a fluence of 1....
An unusual Ni distribution with two completely separated buried and surface silicide layers has been...
We report on the growth of thin NiSi films via the thermal reaction of Ni layers (13-35 nm) with Si(...
An unusual Ni distribution with two completely separated buried and surface silicide layers has been...
An unusual Ni distribution with two completely separated buried and surface silicide layers has been...
We present a systematic study on the effects of CF4 plasma immersion ion implantation (PIII) in Si o...
Nickel silicide formation during the annealing of very high dose (≥4.5 x 10^17 ions/cm^2) Si i...
The effect of ion implantation on the behavior and extent of layer inversion in Ni-silicided poly-Si...
The phase and morphology stability of NiSi and Ni(Pt)Si formed on the poly-Si lines and wide pads ha...
The key feature of this study is to incorporate N2 + implant prior to Ni sputtering on the poly-Si g...
The grain boundaries which included dangling bonds in Ni-metal-induced lateral crystallization (NILC...
An unusual Ni distribution with two completely separated buried and surface silicide layers has been...
The issue of agglomeration and layer inversion has remained critical because conductivity of thin si...
The issue of agglomeration and layer inversion has remained critical because conductivity of thin si...
Nickel (Ni) Metal-Induced-Lateral-Crystallization (MILC) of amorphous Si is a promising technology f...
The formation and distribution of NiSi2 in (111) silicon by Ni-ion implantation with a fluence of 1....
An unusual Ni distribution with two completely separated buried and surface silicide layers has been...
We report on the growth of thin NiSi films via the thermal reaction of Ni layers (13-35 nm) with Si(...
An unusual Ni distribution with two completely separated buried and surface silicide layers has been...
An unusual Ni distribution with two completely separated buried and surface silicide layers has been...
We present a systematic study on the effects of CF4 plasma immersion ion implantation (PIII) in Si o...
Nickel silicide formation during the annealing of very high dose (≥4.5 x 10^17 ions/cm^2) Si i...