The advent of thermoplastics used in bio-medical applications has brought forth the possibility of low cost, mass fabrication of disposable microfluidic devices. Ensuing this new technology, research in the bonding techniques of polymer substrates has gained traction, in aims to produce repeatable, quality high strength joints.! Current research has identified the uncontrollable energy director melt flow as a major problem in manufacturing these microfluidic devices, complicating capillary flow actions, leading to unpredictable fluidic flow.! The present study proposes a novel method in the fabrication of microfluidic chips in aims to attempt to reduce the effect of uncontrollable melt flow with a layer of PDMS introduced with PMMA po...
A reduced channel height in microfluidic Lab-on-a-Chip (LOC) devices enables a reduction in the requ...
The objective of this study was to find optimal bonding parameters to achieve desirable weld quality...
This final year project report describes the method of minimizing the bonding gap to achieve fully f...
The advent of thermoplastics used in bio-medical applications has brought forth the possibility of l...
Microfluidic devices see many advantages in using plastics that include low cost and easily availabl...
Microfluidics and microfluidic droplet technique is a hot topic of study in the recent years. It is ...
A novel technique for bonding polymer substrates using PDMS-interface bonding is presented in this p...
A solvent vapour thermoplastic bonding process is reported which provides high-strength bonding of P...
Over the past two decades, many innovative microfluidic applications have been explored on PDMS-base...
Recently, thermoplastic polymers have become popular materials for microfluidic chips due to their e...
Microfluidic devices have been extensively researched and developed since 1990s. It can be applied ...
AbstractSolvent bonding represents a joining method for thermoplastic materials that results in high...
Thesis (S.M.)--Massachusetts Institute of Technology, Dept. of Mechanical Engineering, 2011.Cataloge...
We compare ultrasonic welding (UW) and thermal bonding (TB) for the integration of embedded thin-fil...
Finding out a rapid and reliable bonding method for plastic microfluidic chips with PCR functions is...
A reduced channel height in microfluidic Lab-on-a-Chip (LOC) devices enables a reduction in the requ...
The objective of this study was to find optimal bonding parameters to achieve desirable weld quality...
This final year project report describes the method of minimizing the bonding gap to achieve fully f...
The advent of thermoplastics used in bio-medical applications has brought forth the possibility of l...
Microfluidic devices see many advantages in using plastics that include low cost and easily availabl...
Microfluidics and microfluidic droplet technique is a hot topic of study in the recent years. It is ...
A novel technique for bonding polymer substrates using PDMS-interface bonding is presented in this p...
A solvent vapour thermoplastic bonding process is reported which provides high-strength bonding of P...
Over the past two decades, many innovative microfluidic applications have been explored on PDMS-base...
Recently, thermoplastic polymers have become popular materials for microfluidic chips due to their e...
Microfluidic devices have been extensively researched and developed since 1990s. It can be applied ...
AbstractSolvent bonding represents a joining method for thermoplastic materials that results in high...
Thesis (S.M.)--Massachusetts Institute of Technology, Dept. of Mechanical Engineering, 2011.Cataloge...
We compare ultrasonic welding (UW) and thermal bonding (TB) for the integration of embedded thin-fil...
Finding out a rapid and reliable bonding method for plastic microfluidic chips with PCR functions is...
A reduced channel height in microfluidic Lab-on-a-Chip (LOC) devices enables a reduction in the requ...
The objective of this study was to find optimal bonding parameters to achieve desirable weld quality...
This final year project report describes the method of minimizing the bonding gap to achieve fully f...