High mobility materials are being considered to replace Si in the channel to achieve higher drive currents and switching speeds. Ge has particularly become of great interest as a channel material, owing to its high bulk hole and electron mobilities. However, replacement of Si channel by Ge requires several critical issues to be addressed in Ge MOS technology. High quality gate dielectric for surface passivation, low parasitic source/drain resistance and performance improvement in Ge NMOS are among the major challenges in realizing Ge CMOS.Bachelor of Engineerin
Thesis: Ph. D., Massachusetts Institute of Technology, Department of Electrical Engineering and Comp...
textSince metal-oxide-semiconductor (MOS) device was first reported around 1959 and utilized for int...
As CMOS continues to scale, new higher mobility channel materials will have to be introduced as an a...
High mobility materials are being considered to replace Si in the channel to achieve higher drive cu...
The performance of strained silicon (Si) as the channel material for today’s metal-oxide-semiconduct...
International audienceThe challenges posed by the scaling of Silicon (Si) devices make mandatory the...
Integration of Ge as the p-FET channel material for 22 nm and beyond technology nodes is receiving i...
textAfter the integrated circuit was invented in 1959, complementary metal-oxidesemiconductor (CMOS...
Silicon-Germanium (SiGe) is considered to substitute Silicon (Si) as channel material in future CMOS...
Germanium is considered to be an alternative channel material for advanced CMOS devices. Due to its ...
As silicon MOSFETs have reached their saturation limits due to aggressive scaling, high mobility cha...
To reach future low power operation at &le0.5 V, high mobility InGaAs nMOS and Ge pMOS were prop...
With the continuous device scaling down as predicted and required by Moore\u27s law, the silicon com...
The quest for higher performance of scaled down technologies resulted in the use of high-mobility su...
We report progress on surface passivation and functionalization of Ge channel surfaces, as well as h...
Thesis: Ph. D., Massachusetts Institute of Technology, Department of Electrical Engineering and Comp...
textSince metal-oxide-semiconductor (MOS) device was first reported around 1959 and utilized for int...
As CMOS continues to scale, new higher mobility channel materials will have to be introduced as an a...
High mobility materials are being considered to replace Si in the channel to achieve higher drive cu...
The performance of strained silicon (Si) as the channel material for today’s metal-oxide-semiconduct...
International audienceThe challenges posed by the scaling of Silicon (Si) devices make mandatory the...
Integration of Ge as the p-FET channel material for 22 nm and beyond technology nodes is receiving i...
textAfter the integrated circuit was invented in 1959, complementary metal-oxidesemiconductor (CMOS...
Silicon-Germanium (SiGe) is considered to substitute Silicon (Si) as channel material in future CMOS...
Germanium is considered to be an alternative channel material for advanced CMOS devices. Due to its ...
As silicon MOSFETs have reached their saturation limits due to aggressive scaling, high mobility cha...
To reach future low power operation at &le0.5 V, high mobility InGaAs nMOS and Ge pMOS were prop...
With the continuous device scaling down as predicted and required by Moore\u27s law, the silicon com...
The quest for higher performance of scaled down technologies resulted in the use of high-mobility su...
We report progress on surface passivation and functionalization of Ge channel surfaces, as well as h...
Thesis: Ph. D., Massachusetts Institute of Technology, Department of Electrical Engineering and Comp...
textSince metal-oxide-semiconductor (MOS) device was first reported around 1959 and utilized for int...
As CMOS continues to scale, new higher mobility channel materials will have to be introduced as an a...