Nowadays, VCSELs are key components for datacom applications. The work presented is focused on the study of the mechanical deformations induced by the steps initiating the manufacturing process of GaAs based VCSELs operating at 850 nm and including aluminum-oxide as confinement layers. The use of non-destructive techniques such as the measurement of the degree of polarization of photoluminescence (DOP) and micro-photoluminescence allowed us to obtain a precise vision both spatially and quantitatively of these mechanical deformations. The effects induced in VCSEL structures after dielectric deposition used as a hard mask for etching, plasma etching of the P-mesa and wet thermal oxidation of the confinement layers have thus been characterized...
This thesis presents the design, fabrication, characterisation and theoretical modelling of oxide c...
Due to their attractive properties, silicon nitride (SiNx) based films have been recognized as essen...
C. W. laser annealing on GaAs was performed using incident powers ranging from 0.5 Pm and 0.8 Pm. Pm...
Nowadays, VCSELs are key components for datacom applications. The work presented is focused on the s...
Les VCSELs sont aujourd'hui des composants incontournables pour les applications datacom. Les travau...
Due to the growing interest in VCSELs and the breadth of their application fields, VCSELs are evolvi...
To face up the increase in their application fields, laser emitters, including VCSELs, are moving ra...
National audienceThe wet oxidation of aluminum-containing III-V semiconductors is an established tec...
International audienceIn-plane micro-photoluminescence (mu-PL) and micro-reflectivity measurements h...
Ce travail de thèse porte sur la fabrication et la caractérisation de lasers à cavité verticale émet...
International audienceThe oxidation of III-V semiconductors is a crucial technological process in th...
This work deals with the fabrication and the characterization of buried oxide-confined vertical-cavi...
International audienceWe propose a simplified and easier fabrication process flow for the manufactur...
This work deals with the design, the fabrication and the characterization of oxidized VCSELs on GaAs...
Vertical cavity surface emitting laser (VCSEL) devices and arrays are increasingly important in meet...
This thesis presents the design, fabrication, characterisation and theoretical modelling of oxide c...
Due to their attractive properties, silicon nitride (SiNx) based films have been recognized as essen...
C. W. laser annealing on GaAs was performed using incident powers ranging from 0.5 Pm and 0.8 Pm. Pm...
Nowadays, VCSELs are key components for datacom applications. The work presented is focused on the s...
Les VCSELs sont aujourd'hui des composants incontournables pour les applications datacom. Les travau...
Due to the growing interest in VCSELs and the breadth of their application fields, VCSELs are evolvi...
To face up the increase in their application fields, laser emitters, including VCSELs, are moving ra...
National audienceThe wet oxidation of aluminum-containing III-V semiconductors is an established tec...
International audienceIn-plane micro-photoluminescence (mu-PL) and micro-reflectivity measurements h...
Ce travail de thèse porte sur la fabrication et la caractérisation de lasers à cavité verticale émet...
International audienceThe oxidation of III-V semiconductors is a crucial technological process in th...
This work deals with the fabrication and the characterization of buried oxide-confined vertical-cavi...
International audienceWe propose a simplified and easier fabrication process flow for the manufactur...
This work deals with the design, the fabrication and the characterization of oxidized VCSELs on GaAs...
Vertical cavity surface emitting laser (VCSEL) devices and arrays are increasingly important in meet...
This thesis presents the design, fabrication, characterisation and theoretical modelling of oxide c...
Due to their attractive properties, silicon nitride (SiNx) based films have been recognized as essen...
C. W. laser annealing on GaAs was performed using incident powers ranging from 0.5 Pm and 0.8 Pm. Pm...