Designing, understanding and controlling the properties of engineered and functional materials, based on oxides and buried interfaces, is one of the most flourishing research fields and one of the major challenges faced by contemporary solid state science and technology. Often, a reliable spectroscopic analysis of such systems is hindered by surface effects, as structural distortion, stoichiometry changes, strong reactivity to external agent and major atomic and/or electronic reconstruction to name but a few. Hard X-Ray PhotoEmission Spectroscopy (HAXPES) is a powerful technique to overcome such limitations, allowing to monitor truly bulk sensitive properties. We report selected HAXPES results for manganese-based oxides, both in films and c...
Many applications in electronics and spintronics rely on interfaces, which are buried a few nanomete...
Hard X-ray photoelectron spectroscopy (HAXPES) is a powerful novel emerging technique for bulk compo...
Abstract The fabrication of small-scale electronics usually involves the integration of different fu...
Designing, understanding and controlling the properties of engineered and functional materials, base...
Designing, understanding and controlling the properties of engineered and functional materials, base...
The electronic properties of surfaces and buried interfaces can vary considerably in comparison to t...
The electronic properties of surfaces and buried interfaces can vary considerably in comparison to t...
Hard X-ray PhotoEmission Spectroscopy (HAXPES) is a new tool for the study of bulk electronic proper...
Hard X-ray PhotoEmission Spectroscopy (HAXPES) is a new tool for the study of bulk electronic proper...
X-ray Photoelectron Spectroscopy (XPS) plays a central role in the investigation of electronic prope...
X-ray Photoelectron Spectroscopy (XPS) plays a central role in the investigation of electronic prope...
X-ray Photoelectron Spectroscopy (XPS) plays a central role in the investigation of electronic prope...
Dataset associated with publication, Faraday Discussion (Issue: Photoelectron spectroscopy and the f...
Many novel materials for device applications consist of multi-layered nano-structures and their func...
Many novel materials for device applications consist of multi-layered nano-structures and their func...
Many applications in electronics and spintronics rely on interfaces, which are buried a few nanomete...
Hard X-ray photoelectron spectroscopy (HAXPES) is a powerful novel emerging technique for bulk compo...
Abstract The fabrication of small-scale electronics usually involves the integration of different fu...
Designing, understanding and controlling the properties of engineered and functional materials, base...
Designing, understanding and controlling the properties of engineered and functional materials, base...
The electronic properties of surfaces and buried interfaces can vary considerably in comparison to t...
The electronic properties of surfaces and buried interfaces can vary considerably in comparison to t...
Hard X-ray PhotoEmission Spectroscopy (HAXPES) is a new tool for the study of bulk electronic proper...
Hard X-ray PhotoEmission Spectroscopy (HAXPES) is a new tool for the study of bulk electronic proper...
X-ray Photoelectron Spectroscopy (XPS) plays a central role in the investigation of electronic prope...
X-ray Photoelectron Spectroscopy (XPS) plays a central role in the investigation of electronic prope...
X-ray Photoelectron Spectroscopy (XPS) plays a central role in the investigation of electronic prope...
Dataset associated with publication, Faraday Discussion (Issue: Photoelectron spectroscopy and the f...
Many novel materials for device applications consist of multi-layered nano-structures and their func...
Many novel materials for device applications consist of multi-layered nano-structures and their func...
Many applications in electronics and spintronics rely on interfaces, which are buried a few nanomete...
Hard X-ray photoelectron spectroscopy (HAXPES) is a powerful novel emerging technique for bulk compo...
Abstract The fabrication of small-scale electronics usually involves the integration of different fu...