Pengaruh suhu pengempaan dan jumlah perekat terhadap sifat papan partikel kayu ketapang (terminalia cattapa linn)

Current utilization of ketapang wood is still limited, such as low construction. furniture and firewoods. It is known as reforestation species. The objectives of the research were to provide information of ketapang wood as panel raw material and the influence of temperature and glue spread on particleboard properties. The research was conducted using two factors, namely pressing temperature and glue spread. Three levels of first factor were 100°C120°C and 140°C denoted by Ti, T, and T3, while the second factor levels were 6%. 8% and 10% denoted by Pr, Pi. and P3. ASTM D - 1037 - 64 was followed for evaluating the physical and mechanical properties of the board, while IHPA method was for formaldehyde emission test. CRD and HSD test were employed in the statistical data analysis. The result showed that interaction factor influence was significant on density. swelling thickness. MOR, compression parallel to the surface, and formaldehyde emission. The maximum density was 0,7493 dcm3, 194.2 kg/cm2 of MOR, 210,6 kg/ cm2 of compression and 9.70% of minimum swelling thichness and 0.211 ppm of emission. All boards confermed the FAO particle board specification. Keywords : particleboard, ketapang word, pressing temperature, glue sprea