Heat Transfer Enhancement in a High Power LED Using Heat Sink with Liquid Pockets

600-603This study presents an experimental investigation on two types of heat sinks, a novel Heat sink with liquid pockets (HSLP) and the other one being conventional heat sink. The heat transfer characteristics of the HSLP were investigated experimentally using passive cooling method. For this purpose, an experimental setup was built by drilling longitudinal holes in the base of heat sink. The holes were filled with De-ionized (DI) water to enhance heat transfer in high-power LED COBs. The junction temperature of the LED was measured, to measure increased heat transfer. The thermal performance of aluminium heat sink with liquid pockets was studied with parameters such as fill ratio, influence of liquid cooling and orientation effect. The performance of the HSLP was found to be better than conventional heat sink of same geometry due to its lower thermal resistance. The HSLP performs better than the conventional heat sink for 15°orintation, 100 vol. % with De-ionized water. Fluid channels filled with liquid in the heat sink have a noticeable effect on heat removal rate