279-282<span style="font-size:14.0pt;line-height: 115%;font-family:" times="" new="" roman";mso-fareast-font-family:"times="" roman";="" color:black;mso-ansi-language:en-in;mso-fareast-language:en-in;mso-bidi-language:="" hi"="" lang="EN-IN">A simple statistical mechanical theory based on compound formation model (compound Aμβv formed by the preferential arrangement of A and B constituent atoms of the alloy AB, μA + vB = AμBv) has been used to investigate the phenomenon of compound formation in CuSn liquid alloys through the study of microscopic function in CuSn liquid alloys, i.e. concentration fluctuation in long wavelength region [Scc(o)] and chemical short range order parameter (α1). The study explains the observed asymmetry suc...
The intermetallic compound Cu3Sn has previously been described as a long-period antiphase boundary s...
This paper investigates the phase equilibria and solidification behavior of Sn-Cu-Ni alloys with com...
International audienceInterfacial reaction between solid e-Cu3Sn compound and liquid Sn at 250 °C is...
This paper presents the use of the transient liquid phase concept to grow the high temperature CuSni...
A series of idealized collisions between a Cu crystal with a surface asperity and a Sn one with a fl...
Energetic of mixing and symmetry at equiatomic composition in liquid Sb-Sn alloys has been investiga...
Sn-Cu alloys have generated interest as potential candidates for high-temperature soldering applicat...
International audienceThe formation of Cu3Sn phase in the soldering reaction is believed to be harmf...
For the core-shell structured immiscible alloys within the immiscible gap, whether the shell is comp...
The viscosity and liquid structure of Cu100-xSnx (x=10, 20, 30, 40, at.%) melts were investigated. T...
The intermetallic compound Cu Sn is a significant microstructural feature of many electronic devices...
The features of Cu6Sn5 growing slowly at lower temperature and growing up rapidly over 350??C, and/o...
In this study, Cu-20wt.Sn alloy was produced by powder metallurgy (PM) method by using high purity e...
Phase equilibria in the Cu-rich corner of the ternary system Cu-Al-Sn have been re-investigated. Fin...
For the core-shell structured immiscible alloys within the immiscible gap, whether the shell is comp...
The intermetallic compound Cu3Sn has previously been described as a long-period antiphase boundary s...
This paper investigates the phase equilibria and solidification behavior of Sn-Cu-Ni alloys with com...
International audienceInterfacial reaction between solid e-Cu3Sn compound and liquid Sn at 250 °C is...
This paper presents the use of the transient liquid phase concept to grow the high temperature CuSni...
A series of idealized collisions between a Cu crystal with a surface asperity and a Sn one with a fl...
Energetic of mixing and symmetry at equiatomic composition in liquid Sb-Sn alloys has been investiga...
Sn-Cu alloys have generated interest as potential candidates for high-temperature soldering applicat...
International audienceThe formation of Cu3Sn phase in the soldering reaction is believed to be harmf...
For the core-shell structured immiscible alloys within the immiscible gap, whether the shell is comp...
The viscosity and liquid structure of Cu100-xSnx (x=10, 20, 30, 40, at.%) melts were investigated. T...
The intermetallic compound Cu Sn is a significant microstructural feature of many electronic devices...
The features of Cu6Sn5 growing slowly at lower temperature and growing up rapidly over 350??C, and/o...
In this study, Cu-20wt.Sn alloy was produced by powder metallurgy (PM) method by using high purity e...
Phase equilibria in the Cu-rich corner of the ternary system Cu-Al-Sn have been re-investigated. Fin...
For the core-shell structured immiscible alloys within the immiscible gap, whether the shell is comp...
The intermetallic compound Cu3Sn has previously been described as a long-period antiphase boundary s...
This paper investigates the phase equilibria and solidification behavior of Sn-Cu-Ni alloys with com...
International audienceInterfacial reaction between solid e-Cu3Sn compound and liquid Sn at 250 °C is...