403-405Nanoparticles have been widely used in oils and polish slurry such as chemical mechanical polish (CMP) process. The movement of nanoparticles in liquid and the interaction between nano-particles and solid surface are very important to obtain an atomic smooth surface in CMP process. This paper presents both experimental and theoretical studies on the movement of nanoparticles in fluid and the collision between nanoparticles as well as that between the particles and solid surfaces in two phases flowing process
Nanoscale polishing finds application in medical, industrial, telecommunication, optics, electronics...
Nanoscale polishing finds applications in medical, industrial, telecommunication, optics, electronic...
A slurry flow field in chemical mechanical polishing (CMP) was analyzed by using particle image velo...
This paper provides a tribochemical study of the selective layer surface by chemical mechanical plan...
Material removal in chemical mechanical polishing (CMP) occurs by a pressure accentuated chemical at...
Abstract: Chemical Mechanical Polishing (CMP) has become the most widely used planarization technolo...
In this paper, the mechanisms of material removal in chemical mechanical polishing (CMP) processes a...
This thesis is concerned with the study of two phase systems stabilised by nanometre sized solid par...
High precision optical components are required for modern life and future. To achieve component’s su...
Le polissage mécano-chimique (CMP pour Chemical Mechanical Polishing) consiste à appliquer une suspe...
By theoretical calculation, the external force on the particle conveyed by pad asperities and the mo...
This work investigates bi-phase flows in a series of experimental and computational studies with a t...
Chemical mechanical polishing (CMP) is a process that is commonly used to planarize wafer surfaces d...
Chemical mechanical polishing (CMP) wastewater generated from semiconductor manufacturing industries...
We investigate the effect of pH on the interactions between a silica slurry and a silica wafer subst...
Nanoscale polishing finds application in medical, industrial, telecommunication, optics, electronics...
Nanoscale polishing finds applications in medical, industrial, telecommunication, optics, electronic...
A slurry flow field in chemical mechanical polishing (CMP) was analyzed by using particle image velo...
This paper provides a tribochemical study of the selective layer surface by chemical mechanical plan...
Material removal in chemical mechanical polishing (CMP) occurs by a pressure accentuated chemical at...
Abstract: Chemical Mechanical Polishing (CMP) has become the most widely used planarization technolo...
In this paper, the mechanisms of material removal in chemical mechanical polishing (CMP) processes a...
This thesis is concerned with the study of two phase systems stabilised by nanometre sized solid par...
High precision optical components are required for modern life and future. To achieve component’s su...
Le polissage mécano-chimique (CMP pour Chemical Mechanical Polishing) consiste à appliquer une suspe...
By theoretical calculation, the external force on the particle conveyed by pad asperities and the mo...
This work investigates bi-phase flows in a series of experimental and computational studies with a t...
Chemical mechanical polishing (CMP) is a process that is commonly used to planarize wafer surfaces d...
Chemical mechanical polishing (CMP) wastewater generated from semiconductor manufacturing industries...
We investigate the effect of pH on the interactions between a silica slurry and a silica wafer subst...
Nanoscale polishing finds application in medical, industrial, telecommunication, optics, electronics...
Nanoscale polishing finds applications in medical, industrial, telecommunication, optics, electronic...
A slurry flow field in chemical mechanical polishing (CMP) was analyzed by using particle image velo...