A copper-based alloy with suitable additives has been developed. Major applications are envisioned in the electronics and vacuum-tube industries. The developed alloy with only half the quantity of silver is less expensive than the standard Ag Cu eutectic alloy and possesses comparable brazing characteristics
Copper-AlN- and copper-Si3N4-composites are used as substrates for semiconductor modules in power el...
Copper has been in use for at least 10,000 years. Copper alloys, such as bronze and brass, have...
Copper-AlN- and copper-Si3N4-composites are used as substrates for semiconductor modules in power el...
"The Bureau of Mines conducted research on substitute brazing filler alloys with properties similar ...
A rapidly solidified (RS) low-sliver brazing alloy with 50% saving in silver has been developed as a...
As the electronics industry begins to focus upon the tin-silver-copper family of alloys as a viable ...
CusilTM is a eutectic brazing alloy of 72% silver, 28% copper composition; used to join different ma...
Alumina dispersion-strengthened copper, Glidcop, is used widely in high-heat-load ultra-high-vacuum ...
Alumina dispersion-strengthened copper, Glidcop, is used widely in high-heat-load ultra-high-vacuum ...
The filler alloy of nominal composition Cu–40Mn–10Ni (all in wt%) was prepared in the form of ribbon...
Copper-based alloys with the addition of Al present excellent properties and can be considered a pro...
The research began with a survey of methods used in the brazing of different metals taking 1965 as a...
A low melting (liquidus temperature \u3c570.degree. C.) rapidly solidified brazing alloy consists es...
A new alloy for fashion products, alternative to traditional die-cast Zamak and hot-forged brass, wa...
Abstract:The microstructure and mechanical properties of brazed joints of oxygen-free copper and oxy...
Copper-AlN- and copper-Si3N4-composites are used as substrates for semiconductor modules in power el...
Copper has been in use for at least 10,000 years. Copper alloys, such as bronze and brass, have...
Copper-AlN- and copper-Si3N4-composites are used as substrates for semiconductor modules in power el...
"The Bureau of Mines conducted research on substitute brazing filler alloys with properties similar ...
A rapidly solidified (RS) low-sliver brazing alloy with 50% saving in silver has been developed as a...
As the electronics industry begins to focus upon the tin-silver-copper family of alloys as a viable ...
CusilTM is a eutectic brazing alloy of 72% silver, 28% copper composition; used to join different ma...
Alumina dispersion-strengthened copper, Glidcop, is used widely in high-heat-load ultra-high-vacuum ...
Alumina dispersion-strengthened copper, Glidcop, is used widely in high-heat-load ultra-high-vacuum ...
The filler alloy of nominal composition Cu–40Mn–10Ni (all in wt%) was prepared in the form of ribbon...
Copper-based alloys with the addition of Al present excellent properties and can be considered a pro...
The research began with a survey of methods used in the brazing of different metals taking 1965 as a...
A low melting (liquidus temperature \u3c570.degree. C.) rapidly solidified brazing alloy consists es...
A new alloy for fashion products, alternative to traditional die-cast Zamak and hot-forged brass, wa...
Abstract:The microstructure and mechanical properties of brazed joints of oxygen-free copper and oxy...
Copper-AlN- and copper-Si3N4-composites are used as substrates for semiconductor modules in power el...
Copper has been in use for at least 10,000 years. Copper alloys, such as bronze and brass, have...
Copper-AlN- and copper-Si3N4-composites are used as substrates for semiconductor modules in power el...