Multi-walled carbon nanotubes (MWCNTs) filled epoxy resin is a type of Electrically Conductive Adhesive (ECA) that is used as interconnect materials in electronics application. Carbon-based conductive adhesive usually has inferior electrical conductivity to silver but mechanically superior in terms of its bonding integrity. The aim of this paper is to study the effect of aspect ratio on the electrical and mechanical properties of the composite adhesive. The aspect ratio of the two types of MWCNT fillers are of 55.5 and 1666.5. The filler loading for both MWCNTs varies from 5 wt.% to 12.7 wt.%. From the experimental study, the sheet resistance for the ECA with higher aspect ratio is approximately 4.42 k?/? in comparison to only 44.86 k?/? fo...
In this work, the effects of single walled carbon nanotubes (SWCNTs) on mechanical and electrical pr...
Carbon nanomaterials secure promises of incorporating exceptional mechanical performance and multifu...
Lead-tin solder has been widely used as interconnection material in electronics packaging for a long...
Multi-walled carbon nanotubes (MWCNTs) filled epoxy resin is a type of Electrically Conductive Adhes...
Multi-walled carbon nanotubes (MWCNTs) filled epoxy resin is a type of Electrically Conductive Adhe...
Carbon nanotubes filled epoxy resin is one type of electrically conductive adhesives (ECAs) that is...
This paper describes the investigations of different functionalised and non functionalised types of ...
Electrically conductive adhesives (ECA) are an alternative to tin/lead solders for attaching Surface...
Adhesives are increasingly being employed as alternatives to mechanical fasteners in aerospace and o...
A combination of metal and non-metal filler in an epoxy resin, called a hybrid electrically conducti...
The fast growing development of the microelectronic industry permanently pushes the development and ...
Electrically conductive adhesives (ECA) are discussed and studied with ever-increasing interest as a...
Over the last twenty years, there is a rapid development in microelectronic industries to support su...
Electronics packaging must be designed to meet the increasing requirements of the microelectronics i...
The part of electronics packaging is steadily forced to adapt the requirements of the microelectroni...
In this work, the effects of single walled carbon nanotubes (SWCNTs) on mechanical and electrical pr...
Carbon nanomaterials secure promises of incorporating exceptional mechanical performance and multifu...
Lead-tin solder has been widely used as interconnection material in electronics packaging for a long...
Multi-walled carbon nanotubes (MWCNTs) filled epoxy resin is a type of Electrically Conductive Adhes...
Multi-walled carbon nanotubes (MWCNTs) filled epoxy resin is a type of Electrically Conductive Adhe...
Carbon nanotubes filled epoxy resin is one type of electrically conductive adhesives (ECAs) that is...
This paper describes the investigations of different functionalised and non functionalised types of ...
Electrically conductive adhesives (ECA) are an alternative to tin/lead solders for attaching Surface...
Adhesives are increasingly being employed as alternatives to mechanical fasteners in aerospace and o...
A combination of metal and non-metal filler in an epoxy resin, called a hybrid electrically conducti...
The fast growing development of the microelectronic industry permanently pushes the development and ...
Electrically conductive adhesives (ECA) are discussed and studied with ever-increasing interest as a...
Over the last twenty years, there is a rapid development in microelectronic industries to support su...
Electronics packaging must be designed to meet the increasing requirements of the microelectronics i...
The part of electronics packaging is steadily forced to adapt the requirements of the microelectroni...
In this work, the effects of single walled carbon nanotubes (SWCNTs) on mechanical and electrical pr...
Carbon nanomaterials secure promises of incorporating exceptional mechanical performance and multifu...
Lead-tin solder has been widely used as interconnection material in electronics packaging for a long...