Bi-directional of a built-in test circuit is proposed to detect open defects at inputs and output interconnects between ICs and a PCB. The test circuit is based on an electrical characteristic of an inverter gate. A test method is related to supply current which flows to the inverter by providing a test signal to the test circuit. The test signal is generated by an AC voltage signal with a DC offset voltage. The open defects which occur at the interconnects will be detected by the large supply current flows to the inverter. On the other hand, if the defects don\u27t occur, the supply current of the inverter is almost zero. Testability of the test circuit is examined using a Spice simulation. The results show that the open defects at the int...
This paper describes a method of developing a Defect Oriented Test (DOT) strategy by using Inductive...
Program year: 1997/1998Digitized from print original stored in HDRWhenever integrated circuits are m...
The test signal method can be used to measure and model inductance parameters (self and mutual) of a...
Nowadays, Ball Grid Array (BGA) becomes a major packaging type due to its high bulk for input/output...
Nowadays, Ball Grid Array (BGA) becomes a major packaging type due to its high bulk for input/output...
Best Paper Award al millor article del congrés IEEE VLSI Test Symposium 2007A proposal for enhancing...
We propose an electrical test method of resistive and capacitive open defects occurring at data bus ...
The fabrication process of modern integrated circuits (ICs) is not perfect and the resulting manufac...
© 2016 IEEE. The detection level of defects in today's mixed-signal ICs lags behind the extremely hi...
Through-silicon vias (TSVs) are critical elements in 3-D integrated circuits susceptible to defects ...
State-of-the-art printed circuit boards (PCBs) have become extremely dense and are not fully accessi...
The development of accurate diagnosis methodologies is important to solve process problems and achi...
An interconnect break is a break that occurs in the inter-connect wiring, which results in logic gat...
CMOS is a popular technology today for very large scale integrated (VLSI) circuits. But, conventiona...
Electronics are still continuing to respond to the small-feature size requirement for economical, pe...
This paper describes a method of developing a Defect Oriented Test (DOT) strategy by using Inductive...
Program year: 1997/1998Digitized from print original stored in HDRWhenever integrated circuits are m...
The test signal method can be used to measure and model inductance parameters (self and mutual) of a...
Nowadays, Ball Grid Array (BGA) becomes a major packaging type due to its high bulk for input/output...
Nowadays, Ball Grid Array (BGA) becomes a major packaging type due to its high bulk for input/output...
Best Paper Award al millor article del congrés IEEE VLSI Test Symposium 2007A proposal for enhancing...
We propose an electrical test method of resistive and capacitive open defects occurring at data bus ...
The fabrication process of modern integrated circuits (ICs) is not perfect and the resulting manufac...
© 2016 IEEE. The detection level of defects in today's mixed-signal ICs lags behind the extremely hi...
Through-silicon vias (TSVs) are critical elements in 3-D integrated circuits susceptible to defects ...
State-of-the-art printed circuit boards (PCBs) have become extremely dense and are not fully accessi...
The development of accurate diagnosis methodologies is important to solve process problems and achi...
An interconnect break is a break that occurs in the inter-connect wiring, which results in logic gat...
CMOS is a popular technology today for very large scale integrated (VLSI) circuits. But, conventiona...
Electronics are still continuing to respond to the small-feature size requirement for economical, pe...
This paper describes a method of developing a Defect Oriented Test (DOT) strategy by using Inductive...
Program year: 1997/1998Digitized from print original stored in HDRWhenever integrated circuits are m...
The test signal method can be used to measure and model inductance parameters (self and mutual) of a...