Comprehensive review of different methods for via filling process in through silicon via (TSV) fabrication

Through silicon vias (TSVs) is a promising technology that has been introduced into high volume manufacturing recently. Through silicon via (TSV) can be customized to fit different design specifications, from dimensions to materials to the location of the vias. This paper gives a comprehensive summary of the TSV fabrication steps, including etch, insulation, and metallization process. In addition, recent researches for various methods applied for via filling process also been discussed. Moreover, the current and future prospects of electroless copper deposition as low cost metallization technology for via filling process had been addressed. In conclusion, electroless copper deposition is a promising technique has a bright future development to be implemented for TSV application