This paper presents three generically similar impingement liquid coolers that have been engineered for cooling power electronics on future aero gas turbines. The thermal and hydraulic performances of the coolers have been compared with that of a commercial, state-of-the-art pin fin liquid cooler. It is demonstrated that the impingement liquid coolers outperform thermally the baseline pin fin cooler, and with significantly lower pressure drops. The impingement liquid coolers could also be easily modified to trade reduced pressure drop against higher flowrate or reduced thermal performance. A scaling model has also been developed to predict the thermal performances of the coolers for other types of coolants and flow conditions. The model has ...
The purpose of this literature review is to compare different cooling technologies currently in deve...
A power electronics module was equipped with an evaporative spray cooling nozzle assembly that serve...
The use of an innovative jet impingement cooling system in a power electronics application is invest...
This paper presents three generically similar impingement liquid coolers that have been engineered f...
Cooling systems significantly contribute to the total mass and volume of power electronic systems. I...
Jet impingement has been an attractive cooling option in a number of industries over the past few de...
Advancements in power electronic technologies require devices which are small, reliable and capable ...
To cope with the increasing cooling demands for future high-performance devices and 3D systems, conv...
This paper is orientated for the ones who are interested in solving the heat dissipation issue that ...
Power electronic devices such as MOSFETs, HEMTs, and IGBTs often face reliability challenges due to ...
The current trend in microelectronics is to manufacture devices with increased computational powers ...
Contemporary electronic systems are currently constrained by the high heat fluxes in which they gene...
The development of semiconductor fabrication process and electronic packaging technology causes the ...
This study investigates the heat transfer performance of finned and pin-fin heat sinks for high powe...
Abstract: Power modules of an electric drivetrain generate some of the highest heat fluxes in the sy...
The purpose of this literature review is to compare different cooling technologies currently in deve...
A power electronics module was equipped with an evaporative spray cooling nozzle assembly that serve...
The use of an innovative jet impingement cooling system in a power electronics application is invest...
This paper presents three generically similar impingement liquid coolers that have been engineered f...
Cooling systems significantly contribute to the total mass and volume of power electronic systems. I...
Jet impingement has been an attractive cooling option in a number of industries over the past few de...
Advancements in power electronic technologies require devices which are small, reliable and capable ...
To cope with the increasing cooling demands for future high-performance devices and 3D systems, conv...
This paper is orientated for the ones who are interested in solving the heat dissipation issue that ...
Power electronic devices such as MOSFETs, HEMTs, and IGBTs often face reliability challenges due to ...
The current trend in microelectronics is to manufacture devices with increased computational powers ...
Contemporary electronic systems are currently constrained by the high heat fluxes in which they gene...
The development of semiconductor fabrication process and electronic packaging technology causes the ...
This study investigates the heat transfer performance of finned and pin-fin heat sinks for high powe...
Abstract: Power modules of an electric drivetrain generate some of the highest heat fluxes in the sy...
The purpose of this literature review is to compare different cooling technologies currently in deve...
A power electronics module was equipped with an evaporative spray cooling nozzle assembly that serve...
The use of an innovative jet impingement cooling system in a power electronics application is invest...