A calculation model to study atomic layer deposition (ALD) in low-pressure channel-type CVD reactor with many parallel substrates is described. The calculations are based on continuity equation and kinetic equation for surface coverage. Formation of a steady-state adsorption wave propagating between the substrates during a precursor pulge is studied. The effect of diffusion and sticking coefficients, carrier gas flow rate and growth temperature on formation and propagation of the steady-state adsorption wave is analysed
Atomic layer deposition (ALD) is a form of chemical vapor deposition that uses cyclic, sequential ga...
During the last two decades, Atomic Layer Deposition (ALD) has emerged as the appropriate process to...
National audienceA three-dimensional Computational Fluid Dynamics (CFD) model is built for a Cambrid...
A detailed mode l for the operation of a f low type atomic layer deposition (ALD) reactor is develo...
A detailed model for the operation of a flow type atomic layer deposition (ALD) reactor is developed...
Computational fluid dynamics investigations on the mixing process of gases inside an atomic layer de...
The conformality of thin films grown by atomic layer deposition (ALD) is studied using all-silicon t...
International audienceA three-dimensional Computational Fluid Dynamics model is built for a commerci...
The requirements of the microelectronic industry, producing high quality electronic devices, has led...
In order to minimize the operational time of atomic layer deposition (ALD) process, flow transports ...
Atomic layer deposition (ALD) is a thin-film manufacturing process in which the growth surface is ex...
Abstract: Tremendous interest has been drawn towards the atomic layer deposition (ALD) as an ultrath...
Atomic layer deposition (ALD) is a technique for depositing thin films of materials with a precise t...
Unparalleled conformality is driving ever new applications for atomic layer deposition (ALD), a thin...
This paper characterizes the carrier gas flow in the atomic layer deposition (ALD) vacuum reactor by...
Atomic layer deposition (ALD) is a form of chemical vapor deposition that uses cyclic, sequential ga...
During the last two decades, Atomic Layer Deposition (ALD) has emerged as the appropriate process to...
National audienceA three-dimensional Computational Fluid Dynamics (CFD) model is built for a Cambrid...
A detailed mode l for the operation of a f low type atomic layer deposition (ALD) reactor is develo...
A detailed model for the operation of a flow type atomic layer deposition (ALD) reactor is developed...
Computational fluid dynamics investigations on the mixing process of gases inside an atomic layer de...
The conformality of thin films grown by atomic layer deposition (ALD) is studied using all-silicon t...
International audienceA three-dimensional Computational Fluid Dynamics model is built for a commerci...
The requirements of the microelectronic industry, producing high quality electronic devices, has led...
In order to minimize the operational time of atomic layer deposition (ALD) process, flow transports ...
Atomic layer deposition (ALD) is a thin-film manufacturing process in which the growth surface is ex...
Abstract: Tremendous interest has been drawn towards the atomic layer deposition (ALD) as an ultrath...
Atomic layer deposition (ALD) is a technique for depositing thin films of materials with a precise t...
Unparalleled conformality is driving ever new applications for atomic layer deposition (ALD), a thin...
This paper characterizes the carrier gas flow in the atomic layer deposition (ALD) vacuum reactor by...
Atomic layer deposition (ALD) is a form of chemical vapor deposition that uses cyclic, sequential ga...
During the last two decades, Atomic Layer Deposition (ALD) has emerged as the appropriate process to...
National audienceA three-dimensional Computational Fluid Dynamics (CFD) model is built for a Cambrid...