Planar impact experiments were performed with high purity (99.9985 %) and commercial purity (99.8 %) tin over the temperature range 115 to 503 K. The free surface velocity histories of 2-mm tin samples impacted by 0.5-mm copper flyer plates having velocity of about 350 m/s were recorded with the VISAR. The impact response of the coarse-grain samples of both the tins is associated with relatively large scattering of the Hugoniot elastic limit, the plastic wave rise time, and the spall strength. The dynamic tensile (spall) strength of both the alloys show weak growth with temperature with exception of the close, 15–20 K vicinity of the tin melting point where the spall strength of both the alloys experiences an abrupt two-fold drop. The dynam...
An assessment of the Sn unary system is presented. First, the literature on phase equilibria, the th...
The physical properties (viscosity, density, electroresistivity and magnetic susceptibility) of pure...
To ensure reliable design of soldered interconnections as electronic devices become smaller, require...
In this work, the β-bct polymorphic transition in tin is investigated by means of plate impact exper...
Abstract. In this work, the β-bct polymorphic transition in tin is investigated by means of plate im...
To investigate shock behavior of tin, particularly β-bct polymorphic transition and melting, shock c...
Shock-induced melting phenomenon in tin material attracts considerable attention recently. Particula...
Several physical properties (density, viscosity, ultrasound velocity, electroresistivity and magneti...
Molecular-dynamics simulation has been used to investigate structural, elastic and thermodynamic pro...
In an effort to understand the influence of different surface finishes and the effect of ejecta mass...
The most recent observations of the response of bulk samples of several lead-free solder alloys, exp...
The effects of a polycrystalline surface layer on the critical resolved shear stress, yield stress a...
The anisotropy of tin is associated with significant variations in its coefficient of thermal expans...
grantor: University of TorontoAn experimental investigation was performed on the splashing...
Equilibrium equation of state theory predicts that the free surface release temperature of shock loa...
An assessment of the Sn unary system is presented. First, the literature on phase equilibria, the th...
The physical properties (viscosity, density, electroresistivity and magnetic susceptibility) of pure...
To ensure reliable design of soldered interconnections as electronic devices become smaller, require...
In this work, the β-bct polymorphic transition in tin is investigated by means of plate impact exper...
Abstract. In this work, the β-bct polymorphic transition in tin is investigated by means of plate im...
To investigate shock behavior of tin, particularly β-bct polymorphic transition and melting, shock c...
Shock-induced melting phenomenon in tin material attracts considerable attention recently. Particula...
Several physical properties (density, viscosity, ultrasound velocity, electroresistivity and magneti...
Molecular-dynamics simulation has been used to investigate structural, elastic and thermodynamic pro...
In an effort to understand the influence of different surface finishes and the effect of ejecta mass...
The most recent observations of the response of bulk samples of several lead-free solder alloys, exp...
The effects of a polycrystalline surface layer on the critical resolved shear stress, yield stress a...
The anisotropy of tin is associated with significant variations in its coefficient of thermal expans...
grantor: University of TorontoAn experimental investigation was performed on the splashing...
Equilibrium equation of state theory predicts that the free surface release temperature of shock loa...
An assessment of the Sn unary system is presented. First, the literature on phase equilibria, the th...
The physical properties (viscosity, density, electroresistivity and magnetic susceptibility) of pure...
To ensure reliable design of soldered interconnections as electronic devices become smaller, require...