Boiling on fins with wire screen of variable effective conductivity

The high scale of integration of modern equipment used for medical, military and other purposes puts heavy demands as regards the removal of great heat fluxes. This can be achieved only in exchangers that apply the phase change phenomena. Among many methods to improve boiling heat transfer, the wire mesh covering demonstrates some advantages due to the possibilities of designing the desired microstructure parameters, availability on the market, and low cost. The wire mesh microstucture with specified geometrical parameters produces anisotropy in conductivity. The different arrangement of the mesh layers relative to the direction of the heat flux is a cause of the change of temperature distribution within the layer. The consequence is a respective change in the discharge conditions of the gas phase and liquid feed. The experiments were conducted on fins covered with a single layer of copper mesh with lumen of 38 % and boiling FC-72 at ambient pressure. Compared with the smooth surface, the wire mesh structures yield an increase in the heat transfer rate at boiling. It is also shown that nucleate boiling is initiated at lower wall superheat. Formulas for longitudinal and perpendicular thermal conductivity are given for different mesh structure arrangements