Thick film polymer pastes with carbon or metallic charges can be used as passive components or electrical connecting elements in hybrid circuit technology. Thermosetting polymer pastes have been prepared to allow utilization temperatures until 125 °C. Carbon pastes have resistivity between 1 MΩ/□ to 10 Ω/□ whereas silver pastes have resistivity lower than 50 mΩ/□. Copper pastes have been recently made to attain a resistivity lower than 20 mΩ/□ with a good solderability. A new curing process using microwave technology allows very short curing time to be attained (some minutes) as for a low resistivity near 10 mΩ/□. Thermal stability and ageing factor are also in favour of microwave technology. Other applications of conducting polymer pastes ...
Conductive silver paste is a key material in the fields of printed circuits and printed electronic d...
This paper describes the evaluation of screen printed materials fabricated with an additive manufact...
AbstractWe investigate in this work the formulation of composite resistive pastes based on epoxy res...
This work speaks about self-regulating heating cable which are product with polymers filled with car...
Les matériaux thermodurcissables sont naturellement des isolants électriques, limitant leurs applica...
In this study we show that the electrical characteristics of low temperature polymer pastes are impr...
Silver nanoparticles produced with a solid-phase thermal decomposition method were used for the prep...
The curing of a thermosetting polymer materials utilized on micro-electronics packaging applications...
Upon completion of the second year of this contract, we have delivered the next generation of polyme...
Thermosetting polymer materials are widely utilised in modern microelectronics packaging technology....
AbstractIn this study we show that the electrical characteristics of low temperature polymer pastes ...
L augmentation incessante de la consommation mondiale des énergies fossiles risque de plonger notre ...
International audienceDuring this last decade, the use of metal matrix composites (MMCs) such as AlS...
This work describes the achievement and the study of an original process to permit the surface metal...
The increase of electronic components in the integrated circuits and the required electrical power s...
Conductive silver paste is a key material in the fields of printed circuits and printed electronic d...
This paper describes the evaluation of screen printed materials fabricated with an additive manufact...
AbstractWe investigate in this work the formulation of composite resistive pastes based on epoxy res...
This work speaks about self-regulating heating cable which are product with polymers filled with car...
Les matériaux thermodurcissables sont naturellement des isolants électriques, limitant leurs applica...
In this study we show that the electrical characteristics of low temperature polymer pastes are impr...
Silver nanoparticles produced with a solid-phase thermal decomposition method were used for the prep...
The curing of a thermosetting polymer materials utilized on micro-electronics packaging applications...
Upon completion of the second year of this contract, we have delivered the next generation of polyme...
Thermosetting polymer materials are widely utilised in modern microelectronics packaging technology....
AbstractIn this study we show that the electrical characteristics of low temperature polymer pastes ...
L augmentation incessante de la consommation mondiale des énergies fossiles risque de plonger notre ...
International audienceDuring this last decade, the use of metal matrix composites (MMCs) such as AlS...
This work describes the achievement and the study of an original process to permit the surface metal...
The increase of electronic components in the integrated circuits and the required electrical power s...
Conductive silver paste is a key material in the fields of printed circuits and printed electronic d...
This paper describes the evaluation of screen printed materials fabricated with an additive manufact...
AbstractWe investigate in this work the formulation of composite resistive pastes based on epoxy res...