The basic principles of the Ion Beam Induced CVD (IBICVD) technique are presented and discussed in comparison with the more common procedure of Plasma Enhanced CVD (PECVD). IBICVD consists of the decomposition of a suitable organometallic precursor by the action of an accelerated beam of O2+ or N2+ ions (E < 1000 eV), depending on whether oxide or nitride thin films are to be prepared. The importance of the ballistic effects in inducing the room temperature decomposition of the precursors is illustrated by some experiments with X-ray photoemission and model organometallic compounds. They account for the high purity of the films prepared by IBICVD, where only minor amounts of carbon or other contaminant species present in the precursor can b...
In this paper we present a study of the formation of TiN thin films during the IBAD process. We have...
The paper discusses microstructure, mechanical and physical testing with several examples of advance...
The nitrides of the reactive transition metals of the 4th group (Ti, Zr, Hf) exhibit a number of tec...
We proposed an experimental methodology for producing films on substrates with an ion beam induced c...
This is the final report of a three-year, Laboratory Directed Research and Development (LDRD) projec...
VLSI device design rules as well as compound semiconductor device manufacture require dielectric fil...
The object of investigation: lead molybdate, zinc oxide, aluminium nitride and silicone nitride. The...
[[abstract]]TiN, VN and CrN were systematically deposited on silicon substrates using ion beam assis...
Tin dioxide thin films have been prepared by Ion Beam Induced Chemical Vapour Deposition [IBICVD]. T...
Various processes can generate energetic particles suitable for thin film deposition. In some more c...
Thin CNx films have been deposited on silicon substrates by inductively coupled plasma chemical vapo...
Silicon nitride (SiNx, x!1) thin films were deposited by chemical vapor deposition on silicon oxide ...
The atomic layer deposition (ALD) technique has recently gained considerable interest as a suitable ...
Atomic Layer Deposition (ALD) is a vapor-phase deposition technique in which ultrathin films are syn...
It is believed that during the initial stage of diamond film growth by chemical-vapor deposition (CV...
In this paper we present a study of the formation of TiN thin films during the IBAD process. We have...
The paper discusses microstructure, mechanical and physical testing with several examples of advance...
The nitrides of the reactive transition metals of the 4th group (Ti, Zr, Hf) exhibit a number of tec...
We proposed an experimental methodology for producing films on substrates with an ion beam induced c...
This is the final report of a three-year, Laboratory Directed Research and Development (LDRD) projec...
VLSI device design rules as well as compound semiconductor device manufacture require dielectric fil...
The object of investigation: lead molybdate, zinc oxide, aluminium nitride and silicone nitride. The...
[[abstract]]TiN, VN and CrN were systematically deposited on silicon substrates using ion beam assis...
Tin dioxide thin films have been prepared by Ion Beam Induced Chemical Vapour Deposition [IBICVD]. T...
Various processes can generate energetic particles suitable for thin film deposition. In some more c...
Thin CNx films have been deposited on silicon substrates by inductively coupled plasma chemical vapo...
Silicon nitride (SiNx, x!1) thin films were deposited by chemical vapor deposition on silicon oxide ...
The atomic layer deposition (ALD) technique has recently gained considerable interest as a suitable ...
Atomic Layer Deposition (ALD) is a vapor-phase deposition technique in which ultrathin films are syn...
It is believed that during the initial stage of diamond film growth by chemical-vapor deposition (CV...
In this paper we present a study of the formation of TiN thin films during the IBAD process. We have...
The paper discusses microstructure, mechanical and physical testing with several examples of advance...
The nitrides of the reactive transition metals of the 4th group (Ti, Zr, Hf) exhibit a number of tec...