The present work concerns the formation of chromium and/or aluminide diffusion coatings on nickel, by means of a pack and fluidised bed chemical vapour deposition (PBCVD and FBCVD) process. The object to be treated is suspended within the reactor, which contains the treating agent. The latter is a mixture of powders of the donor of the coating-forming element (Al, Cr, Al-Cr) and of a filler material (Al2O3). As an activator of the process, a halide compound is used (NaCl, NH4Cl, NaCl + NH4Cl, HCl) in an inert atmosphere (Ar). The precursor vapours of the element to be deposited are formed in situ, by the reaction of the donor with the activator and react with the substrate surface for the formation of the coatings. The produced coatings are...
The codeposition of chromium and a luminum in cementat ion packs containing a Cr-5 weight percent (w...
With the aid of computer-assisted calculations of the equilibrium vapor pressures in halide-activate...
The need for faster and smaller integrated circuits and other devices is necessitating deposition of...
Masters thesis deals with formation of diffusion barrier coatings by means of powder mixtures chemic...
The basic method of surface protection for aviation engine components manufactured from nickel super...
In this study, nickel aluminide coatings were deposited onto CMSX-4 single crystal superalloy and pu...
The pack-cementation process is a widespread technique used to obtain protective coatings formed by ...
A single-step, chloride-activated pack cementation process has been developed for growing a Cr/RE(Y,...
This paper describes studies of CVD processes of technical relevance, in which some unusual and unex...
A CVD method was successfully developed to produce conversion coatings on aluminum alloys surfaces w...
A single-step chloride-activated pack cementation process has been developed for growing a Cr/RE(Y, ...
Halide Activated Pack Cementation (HAPC) is a surface modification process that is a cost-effective ...
CrN coatings were formed on plain carbon steel by prenitrocarburizing, followed by thermoreactive de...
The new deposition process, combustion chemical vapor deposition, shows a great deal of promise in t...
Abstract. Metalorganic precursors allow a significant decrease of the deposition temperature in CVD ...
The codeposition of chromium and a luminum in cementat ion packs containing a Cr-5 weight percent (w...
With the aid of computer-assisted calculations of the equilibrium vapor pressures in halide-activate...
The need for faster and smaller integrated circuits and other devices is necessitating deposition of...
Masters thesis deals with formation of diffusion barrier coatings by means of powder mixtures chemic...
The basic method of surface protection for aviation engine components manufactured from nickel super...
In this study, nickel aluminide coatings were deposited onto CMSX-4 single crystal superalloy and pu...
The pack-cementation process is a widespread technique used to obtain protective coatings formed by ...
A single-step, chloride-activated pack cementation process has been developed for growing a Cr/RE(Y,...
This paper describes studies of CVD processes of technical relevance, in which some unusual and unex...
A CVD method was successfully developed to produce conversion coatings on aluminum alloys surfaces w...
A single-step chloride-activated pack cementation process has been developed for growing a Cr/RE(Y, ...
Halide Activated Pack Cementation (HAPC) is a surface modification process that is a cost-effective ...
CrN coatings were formed on plain carbon steel by prenitrocarburizing, followed by thermoreactive de...
The new deposition process, combustion chemical vapor deposition, shows a great deal of promise in t...
Abstract. Metalorganic precursors allow a significant decrease of the deposition temperature in CVD ...
The codeposition of chromium and a luminum in cementat ion packs containing a Cr-5 weight percent (w...
With the aid of computer-assisted calculations of the equilibrium vapor pressures in halide-activate...
The need for faster and smaller integrated circuits and other devices is necessitating deposition of...