It is well known that in thin metallic films, the anelastic and the elastic properties show some characteristic features linked to the specific microstructure. The studied films Cu30Mo70, with a typical thickness of 200nm are deposited by Ion Beam Sputtering (IBS) on oxidised silicon (100) substrates. The measurements are performed on a vibrating reed device adapted for thin adherent films over a temperature range between 20°C and 450°C. This paper reports the combined results of internal friction, elastic modulus and internal stresses measured during thermal cycling. "Direct" observations of the microstructure are performed by X-Ray diffraction. We have correlated the modifications of the mechanical properties with the structural evolution...
Copper films of different thicknesses of 0.2, 0.5, 1 and 2 microns were electroplated on top of the ...
The temperature-dependent mechanical behavior of passivated copper films is studied. Stresses in cop...
The temperature-dependent mechanical behavior of passivated copper films is studied. Stresses in cop...
The vibrating-reed technique has been successfully adapted to internal friction studies of thin-laye...
Thin FCC metal films are used in a wide range of micro- and nano-fabricated devices. These films may...
Using a vibrating reed device with micro structurized Si reeds the dynamic mechanical properties You...
International audienceComparative studies of the mechanical behavior between copper, tungsten, and W...
vention of the Society for Nondestructive Testing. The elastic and plastic properties are reviewed w...
The thermomechanical behavior of passivated thin copper films is studied. Stresses in copper films o...
open5noAbstract: In the present research, results are presented regarding the anelasticity of 99.999...
Restricted until 03 Nov. 2012.The correlation between external (e.g. power, pressure) and internal (...
In this paper a technique developed for studying the anelastic behavior of nano-...
The in situ characterization of the deformation and fracture behavior of brittle metal films is of g...
In this study, the structural and nanomechanical properties of Cu2O thin films are investigated by X...
The mechanical properties of metallic thin films deposited on silicon by magnetron sputtering and ...
Copper films of different thicknesses of 0.2, 0.5, 1 and 2 microns were electroplated on top of the ...
The temperature-dependent mechanical behavior of passivated copper films is studied. Stresses in cop...
The temperature-dependent mechanical behavior of passivated copper films is studied. Stresses in cop...
The vibrating-reed technique has been successfully adapted to internal friction studies of thin-laye...
Thin FCC metal films are used in a wide range of micro- and nano-fabricated devices. These films may...
Using a vibrating reed device with micro structurized Si reeds the dynamic mechanical properties You...
International audienceComparative studies of the mechanical behavior between copper, tungsten, and W...
vention of the Society for Nondestructive Testing. The elastic and plastic properties are reviewed w...
The thermomechanical behavior of passivated thin copper films is studied. Stresses in copper films o...
open5noAbstract: In the present research, results are presented regarding the anelasticity of 99.999...
Restricted until 03 Nov. 2012.The correlation between external (e.g. power, pressure) and internal (...
In this paper a technique developed for studying the anelastic behavior of nano-...
The in situ characterization of the deformation and fracture behavior of brittle metal films is of g...
In this study, the structural and nanomechanical properties of Cu2O thin films are investigated by X...
The mechanical properties of metallic thin films deposited on silicon by magnetron sputtering and ...
Copper films of different thicknesses of 0.2, 0.5, 1 and 2 microns were electroplated on top of the ...
The temperature-dependent mechanical behavior of passivated copper films is studied. Stresses in cop...
The temperature-dependent mechanical behavior of passivated copper films is studied. Stresses in cop...