Miniature aluminium gallium arsenide/gallium arsenide (AlGaAs/GaAs) coolers were fabricated on wafer, enabling different contact geometries to be realized in the same process run. To individually DC bias the microcooler, microprobes were used leading to thermal loading of the cooler. A simple experimental technique was developed to verify the temperature difference (ΔT) between the cold cathode and hot anode contacts is due to cooling rather than heating of the cooler
The experimental characterization of single barrier heterostructure thermionic cooling devices at cr...
Cryocoolers are refrigerators capable of reaching temperatures below roughly 120 kelvin. Such cooler...
A micro-channel heat sink is a promising cooling method for high power integrated circuits (IC). How...
The packing density and power capacity of integrated electronics is increasing resulting in higher t...
Modern high frequency electronic devices are continually becoming smaller in area but capable of gen...
Electronic devices are shrinking in size and new materials, for example gallium nitride (GaN) are b...
Electronic devices are shrinking in size and new materials, for example gallium nitride (GaN) are b...
International audienceWe present results from optical characterization of active solid-state SiGe/Si...
A novel gallium arsenide (GaAs) based micro-cooler design, previously analysed both experimentally a...
The thermal behaviour of a micro-cooler has beeninvestigated using two different measurement methods...
Two types of GaAs-based microcoolers have been demonstrated for the first time. One has a 2 μm therm...
With the increase in the chip packaging density the amount of heat generated from them has also incr...
This paper presents for the first time an accurate thermal characterization of thin film heaters man...
Thermal management of next generation of semiconductor devices is becoming more challenging, as the ...
The authors describe a class of microscale heaters fabricated with CMOS processes on silicon wafers....
The experimental characterization of single barrier heterostructure thermionic cooling devices at cr...
Cryocoolers are refrigerators capable of reaching temperatures below roughly 120 kelvin. Such cooler...
A micro-channel heat sink is a promising cooling method for high power integrated circuits (IC). How...
The packing density and power capacity of integrated electronics is increasing resulting in higher t...
Modern high frequency electronic devices are continually becoming smaller in area but capable of gen...
Electronic devices are shrinking in size and new materials, for example gallium nitride (GaN) are b...
Electronic devices are shrinking in size and new materials, for example gallium nitride (GaN) are b...
International audienceWe present results from optical characterization of active solid-state SiGe/Si...
A novel gallium arsenide (GaAs) based micro-cooler design, previously analysed both experimentally a...
The thermal behaviour of a micro-cooler has beeninvestigated using two different measurement methods...
Two types of GaAs-based microcoolers have been demonstrated for the first time. One has a 2 μm therm...
With the increase in the chip packaging density the amount of heat generated from them has also incr...
This paper presents for the first time an accurate thermal characterization of thin film heaters man...
Thermal management of next generation of semiconductor devices is becoming more challenging, as the ...
The authors describe a class of microscale heaters fabricated with CMOS processes on silicon wafers....
The experimental characterization of single barrier heterostructure thermionic cooling devices at cr...
Cryocoolers are refrigerators capable of reaching temperatures below roughly 120 kelvin. Such cooler...
A micro-channel heat sink is a promising cooling method for high power integrated circuits (IC). How...