To address issues associated with continual scaling of the International Technology Roadmap for Semiconductors (ITRS) (1) to follow Moore's Law, MOSFETs with high mobility channel materials are now being seriously considered. As a result, there has been a significant expansion in research into HI-V MOSFETs as a potential n-channel device solution. A wide range of high electron mobility channel materials, device architectures and gate oxides are currently being considered, and in this review, key performance metrics of III-V MOSFETs will be compared
textSince metal-oxide-semiconductor (MOS) device was first reported around 1959 and utilized for int...
For the last few decades, Si CMOS technology has been driven by device scaling to increase performan...
The unproved transport properties of new channel materials, such as Ge and III-V semiconductors, alo...
To address issues associated with continual scaling of the International Technology Roadmap for Semi...
We analyze a modem-day 65nm MOSFET technology to determine its electrical characteristics and intrin...
We have studied the performance potential of sub 100 nm compound MOSFETs with InGaAs channel and hig...
Channel materials alternative to silicon have been recently introduced as a new scaling scenario to ...
The high electron mobility of compound semiconductor materials, arising from the combination of low ...
1 µm GaAs enhancement-mode MOSFETs have been manufactured with a threshold voltage, maximum drain c...
© 2013 IEEE. After 50 years of Moore's Law, Si CMOS, the mainstream logic technology, is on a course...
session 8: Post Silicon Materials and DevicesInternational audienceIII-V materials are an attractive...
Developments over the last 15 years in the areas of materials and devices have finally delivered com...
Over the years, many new materials have been introduced in advanced complementary metal oxide semico...
The quest for high device density in advanced technology nodes makes strain engineering increasingly...
Low power and high density requires scaling of MOSFETs in VLSI. As the Si based bulk MOSFETs scale d...
textSince metal-oxide-semiconductor (MOS) device was first reported around 1959 and utilized for int...
For the last few decades, Si CMOS technology has been driven by device scaling to increase performan...
The unproved transport properties of new channel materials, such as Ge and III-V semiconductors, alo...
To address issues associated with continual scaling of the International Technology Roadmap for Semi...
We analyze a modem-day 65nm MOSFET technology to determine its electrical characteristics and intrin...
We have studied the performance potential of sub 100 nm compound MOSFETs with InGaAs channel and hig...
Channel materials alternative to silicon have been recently introduced as a new scaling scenario to ...
The high electron mobility of compound semiconductor materials, arising from the combination of low ...
1 µm GaAs enhancement-mode MOSFETs have been manufactured with a threshold voltage, maximum drain c...
© 2013 IEEE. After 50 years of Moore's Law, Si CMOS, the mainstream logic technology, is on a course...
session 8: Post Silicon Materials and DevicesInternational audienceIII-V materials are an attractive...
Developments over the last 15 years in the areas of materials and devices have finally delivered com...
Over the years, many new materials have been introduced in advanced complementary metal oxide semico...
The quest for high device density in advanced technology nodes makes strain engineering increasingly...
Low power and high density requires scaling of MOSFETs in VLSI. As the Si based bulk MOSFETs scale d...
textSince metal-oxide-semiconductor (MOS) device was first reported around 1959 and utilized for int...
For the last few decades, Si CMOS technology has been driven by device scaling to increase performan...
The unproved transport properties of new channel materials, such as Ge and III-V semiconductors, alo...