This work reports on the development and fabrication of High Electron Mobility Transistors with a gate length of less than 30nm. The T-shaped gates were realized using a two-stage "bi-lithography" process that creates a T-shaped image in a bilayer of PMMA and UVIII. This is then transferred into SiO<sub>2</sub> gate support layer by a low damage dry-etch process. This method enables the fabrication of mechanically robust, ultra short T-gates to be realised
We previously reported a procedure for the fabrication of high electron mobility transistors (HEMTs)...
A fabrication technique for sub-50-nm T-shaped-gate InGaAs/InAlAs high electron mobility transistors...
Fifty nanometre gate length T-gates In<sub>0.52</sub>A1<sub>0.48</sub>As/In&...
This work reports on the development and fabrication of High Electron Mobility Transistors with a g...
In this article, we report a procedure for the fabrication of ultrashort T gates using high resoluti...
In this article, we report a procedure for the fabrication of ultrashort T gates using high resoluti...
In this article, we report a procedure for the fabrication of ultrashort T gates using high resoluti...
We developed a novel double-level-T-gate technology based on wet etching of a metal gate interlayer....
We developed a novel double-level-T-gate technology based on wet etching of a metal gate interlayer....
We developed a novel double-level-T-gate technology based on wet etching of a metal gate interlayer....
We developed a novel double-level-T-gate technology based on wet etching of a metal gate interlayer....
We developed a novel double-level-T-gate technology based on wet etching of a metal gate interlayer....
A new process has been developed to fabricate 30 nm T gates for high performance metal–semiconductor...
We previously reported a procedure for the fabrication of high electron mobility transistors (HEMTs)...
We previously reported a procedure for the fabrication of high electron mobility transistors (HEMTs)...
We previously reported a procedure for the fabrication of high electron mobility transistors (HEMTs)...
A fabrication technique for sub-50-nm T-shaped-gate InGaAs/InAlAs high electron mobility transistors...
Fifty nanometre gate length T-gates In<sub>0.52</sub>A1<sub>0.48</sub>As/In&...
This work reports on the development and fabrication of High Electron Mobility Transistors with a g...
In this article, we report a procedure for the fabrication of ultrashort T gates using high resoluti...
In this article, we report a procedure for the fabrication of ultrashort T gates using high resoluti...
In this article, we report a procedure for the fabrication of ultrashort T gates using high resoluti...
We developed a novel double-level-T-gate technology based on wet etching of a metal gate interlayer....
We developed a novel double-level-T-gate technology based on wet etching of a metal gate interlayer....
We developed a novel double-level-T-gate technology based on wet etching of a metal gate interlayer....
We developed a novel double-level-T-gate technology based on wet etching of a metal gate interlayer....
We developed a novel double-level-T-gate technology based on wet etching of a metal gate interlayer....
A new process has been developed to fabricate 30 nm T gates for high performance metal–semiconductor...
We previously reported a procedure for the fabrication of high electron mobility transistors (HEMTs)...
We previously reported a procedure for the fabrication of high electron mobility transistors (HEMTs)...
We previously reported a procedure for the fabrication of high electron mobility transistors (HEMTs)...
A fabrication technique for sub-50-nm T-shaped-gate InGaAs/InAlAs high electron mobility transistors...
Fifty nanometre gate length T-gates In<sub>0.52</sub>A1<sub>0.48</sub>As/In&...