The viscosity thermal dependence of paste material for electronics

The work is focused on properties of paste materials for electronics. Soldering pastes and pastes for screen printing were tested. The dynamic viscosity dependencies of pastes were analyzed. Viscosity of paste strongly affected the result of technological process. Viscosity is changed with temperature. Mentioned pastes belong to non Newtonian fluids. That means that viscosity of pastes is changed with shear rate too. Viscosity dependence on temperature increasing from room temperature to 50°C approximately was measured for chosen samples. Differences between viscosity of paste at room temperature and viscosity at storage temperature in refrigerator were determined too. Dial viscometer HBT type was used for viscosity measurement. Viscometer was equipped by measuring system with geometrical configuration cone – plate and system with standard disc spindle