Open-pore Mg foams, which have been traditionally discarded for heat dissipation applications given their low thermal conductivity values, can prove appealing materials for active thermal management if they incorporate diamond particles coated with a nano-dimensioned layer of TiC. These composite foam materials can be manufactured by the replication method, conveniently adapted to Mg, that requires a strict multi-scale control: correct distribution of structural constituents (pores, diamond and Mg) on the meso-/micro-scale ensures homogeneity and complete pore connectivity, while a proper nanoscale control of the TiC coating on diamond particles achieves high thermal conductance at the interface between diamond particles and Mg. The manufac...
Diamond-based metal matrix composites have been made based on pure Al and eutectic Ag-3Si alloy by g...
Thermal management has become a ‘hot’ field in recent years due to a need to obtain high performance...
Microelectronics innovate and advance technology to new limits every day. Microelectronics are in ev...
Traditional metal foams, which are incapable to meet the heat dissipation demands of today’s electro...
Realizing high-efficiency thermal management is of great significance for the fast growth of high-pe...
The manuscript shows that nano-engineering the surface of diamond particles prior contacting the liq...
Thermal conductivity enhancement of phase change materials with 3D porous diamond foam for thermal e...
The recent progress made in active thermal management for electronics demands the development of new...
A new design route is proposed in order to fabricate aluminum matrix diamond-containing composite ma...
Phase change materials with considerable heat effect during phase change have been regarded as one o...
The increasing power density of electronic devices and components requires the development of new co...
Today, the microelectronics industry uses higher functioning frequencies in commercialized component...
Al/diamond composites containing diamond particles of different qualities have been manufactured by ...
Despite the importance of interface engineering in technological metal matrix composites, both syste...
Thanks to its planar structure, graphene is characterized by unique properties, such as excellent ch...
Diamond-based metal matrix composites have been made based on pure Al and eutectic Ag-3Si alloy by g...
Thermal management has become a ‘hot’ field in recent years due to a need to obtain high performance...
Microelectronics innovate and advance technology to new limits every day. Microelectronics are in ev...
Traditional metal foams, which are incapable to meet the heat dissipation demands of today’s electro...
Realizing high-efficiency thermal management is of great significance for the fast growth of high-pe...
The manuscript shows that nano-engineering the surface of diamond particles prior contacting the liq...
Thermal conductivity enhancement of phase change materials with 3D porous diamond foam for thermal e...
The recent progress made in active thermal management for electronics demands the development of new...
A new design route is proposed in order to fabricate aluminum matrix diamond-containing composite ma...
Phase change materials with considerable heat effect during phase change have been regarded as one o...
The increasing power density of electronic devices and components requires the development of new co...
Today, the microelectronics industry uses higher functioning frequencies in commercialized component...
Al/diamond composites containing diamond particles of different qualities have been manufactured by ...
Despite the importance of interface engineering in technological metal matrix composites, both syste...
Thanks to its planar structure, graphene is characterized by unique properties, such as excellent ch...
Diamond-based metal matrix composites have been made based on pure Al and eutectic Ag-3Si alloy by g...
Thermal management has become a ‘hot’ field in recent years due to a need to obtain high performance...
Microelectronics innovate and advance technology to new limits every day. Microelectronics are in ev...