This dissertation presents a new approach to prognostics and health monitoring for automotive applications using a piezoresistive silicon stress sensor. The stress sensor is a component with promising performance for monitoring the condition of an electronic system, as it is able to measure stress values that can be directly related to the damage sustained by the system. The primary challenge in this study is to apply a stress sensor to system-level monitoring. To achieve this goal, this study firstly evaluates the uncertainties of measurement conducted with the sensor, and then the study develops a reliable solution for gathering data with a large number of sensors. After overcoming these preliminary challenges, the study forms a framewor...
Abstract: Currently, automotive electronics and sensor systems are partially integrated. Therefore,...
This article presents an approach developed for collecting and processing data about the actual stre...
The experimental observation of the actual thermo mechanical weak points in microelectronics package...
This dissertation presents a new approach to prognostics and health monitoring for automotive applic...
A piezoresistive silicon based stress sensor has been demonstrated successfully as an effective tool...
Recent advancements in automotive technologies, most notably autonomous driving, demand electronic s...
Recent trends in automotive electronics such as automated driving will increase the number and compl...
Miniaturization and simultaneous increase of complexity and functionality of modern electronic contr...
Recent advancements in automotive technologies, most notably autonomous driving, demand electronic s...
In dieser Dissertation wird ein neues Vorgehen an Prognostics and Health Monitoring für Automobilean...
This paper presents a failure mode detection methodology using a piezoresistive silicon based stress...
Nowadays electronic systems used in automotive industry consolidate a variety of functionalities and...
Today, Scania CV AB is facing challenging demands on functionality and performance within their vehi...
The relaxation behavior of an epoxy molding compound (EMC) subjected to a constant strain can cause ...
Electronics are subjected to thermal, mechanical or chemical stress conditions during their operatio...
Abstract: Currently, automotive electronics and sensor systems are partially integrated. Therefore,...
This article presents an approach developed for collecting and processing data about the actual stre...
The experimental observation of the actual thermo mechanical weak points in microelectronics package...
This dissertation presents a new approach to prognostics and health monitoring for automotive applic...
A piezoresistive silicon based stress sensor has been demonstrated successfully as an effective tool...
Recent advancements in automotive technologies, most notably autonomous driving, demand electronic s...
Recent trends in automotive electronics such as automated driving will increase the number and compl...
Miniaturization and simultaneous increase of complexity and functionality of modern electronic contr...
Recent advancements in automotive technologies, most notably autonomous driving, demand electronic s...
In dieser Dissertation wird ein neues Vorgehen an Prognostics and Health Monitoring für Automobilean...
This paper presents a failure mode detection methodology using a piezoresistive silicon based stress...
Nowadays electronic systems used in automotive industry consolidate a variety of functionalities and...
Today, Scania CV AB is facing challenging demands on functionality and performance within their vehi...
The relaxation behavior of an epoxy molding compound (EMC) subjected to a constant strain can cause ...
Electronics are subjected to thermal, mechanical or chemical stress conditions during their operatio...
Abstract: Currently, automotive electronics and sensor systems are partially integrated. Therefore,...
This article presents an approach developed for collecting and processing data about the actual stre...
The experimental observation of the actual thermo mechanical weak points in microelectronics package...