Sintering of ceramic films on a solid substrate is an important technology for fabricating a range of products, including solid oxide fuel cells, micro-electronic PZT films and protective coatings. There is clear evidence that the constrained sintering process is anisotropic in nature. This paper presents a study of the constrained sintering deformation using an anisotropic constitutive law. The state of the material is described using the sintering strains rather than the relative density. In the limiting case of free sintering, the constitutive law reduces to a conventional isotropic constitutive law. The anisotropic constitutive law is used to calculate sintering deformation of a constrained film bonded to a rigid substrate and the compr...
Constrained sintering is a common step during the fabrication of devices such as integrated circuit ...
A physical model has been developed for the initial stage of sintering of thin constrained polycryst...
3YSZ green layers approximately 10 μm thick were screen printed onto 3YSZ substrates up to 300 μm in...
Material microstructure and properties become anisotropic during the sintering of cofired ceramics, ...
Sintering is a common technique for the production of ceramic, metallic and composite bodies and com...
NUMIFORM 2010: Proceedings of the 10th International Conference on Numerical Methods in Industrial F...
Alumina thin films deposited by dip coating on alumina substrates were sintered between 1150° and 13...
The present work deals with a continuum mechanical description of sintering of glass ceramic materia...
A viscoelastic finite element model is developed to simulate the constant heating rate sintering of ...
Simulations based on the discrete element method are employed to investigate the anisotropic sinteri...
The majority of ceramic parts are made by forming a powder compact, known as a green body, which is ...
International audienceSintering is a key step that determines the mechanical performances and shape ...
International audienceIn the domain of ceramic additive manufacturing, sintering is a key step for c...
While significant progress in modeling of sintering has been accomplished since the original paper b...
Metallic substrates incorporated in multilayered systems have a nonlinear creep behavior at the sint...
Constrained sintering is a common step during the fabrication of devices such as integrated circuit ...
A physical model has been developed for the initial stage of sintering of thin constrained polycryst...
3YSZ green layers approximately 10 μm thick were screen printed onto 3YSZ substrates up to 300 μm in...
Material microstructure and properties become anisotropic during the sintering of cofired ceramics, ...
Sintering is a common technique for the production of ceramic, metallic and composite bodies and com...
NUMIFORM 2010: Proceedings of the 10th International Conference on Numerical Methods in Industrial F...
Alumina thin films deposited by dip coating on alumina substrates were sintered between 1150° and 13...
The present work deals with a continuum mechanical description of sintering of glass ceramic materia...
A viscoelastic finite element model is developed to simulate the constant heating rate sintering of ...
Simulations based on the discrete element method are employed to investigate the anisotropic sinteri...
The majority of ceramic parts are made by forming a powder compact, known as a green body, which is ...
International audienceSintering is a key step that determines the mechanical performances and shape ...
International audienceIn the domain of ceramic additive manufacturing, sintering is a key step for c...
While significant progress in modeling of sintering has been accomplished since the original paper b...
Metallic substrates incorporated in multilayered systems have a nonlinear creep behavior at the sint...
Constrained sintering is a common step during the fabrication of devices such as integrated circuit ...
A physical model has been developed for the initial stage of sintering of thin constrained polycryst...
3YSZ green layers approximately 10 μm thick were screen printed onto 3YSZ substrates up to 300 μm in...