A printed circuit board via is analyzed as a collection of sections bounded by grounded planes. A semianalytical expression for the capacitance of such a section is deduced and numerically adapted to solutions obtained with the finite‐element method. For high permittivities, one may also estimate the capacitance of a via terminating at a dielectric interface
Interdigitated electrode structures have applications in a myriad of fields and have become attracti...
This letter examines the capacitance of coplanar waveguides (CPWs) in multilayer dielectric substrat...
Shared-antipad via structure is commonly used for high-speed printed circuit board (PCB) design. The...
The capacitances of multilayered board vias are calculated by means of two methods: the Schwarz-Chri...
Abstract Passive components embedded in printed circuit boards promise several advantages. In high-s...
The article analyzes the mutual capacitance and inductance of printed circuit and introduces an eval...
In this paper, a new integral equation formulation for via structures is developed for the capacitan...
The via-plate capacitance for a via transition to a multilayer printed circuit board is evaluated an...
In this paper calculations of the capacitance per unit length of one or multilayer dielectric lines ...
In this work we show the influence of the edge-effect on the electric field distribution, and hence ...
Abstract- Embedded capacitance is an alternative to discrete decoupling capacitors and is achieved b...
A simple yet efficient approach is presented to extract the via-plane capacitances for an offset via...
The classical analysis of a plane parallel capacitor gives a capacitance which becomes infinite as t...
The net ground plane inductance of printed circuit boards is the source of common-mode radiated emis...
The partial element equivalent circuit (PEEC) method has proven to be useful for electromagnetic mod...
Interdigitated electrode structures have applications in a myriad of fields and have become attracti...
This letter examines the capacitance of coplanar waveguides (CPWs) in multilayer dielectric substrat...
Shared-antipad via structure is commonly used for high-speed printed circuit board (PCB) design. The...
The capacitances of multilayered board vias are calculated by means of two methods: the Schwarz-Chri...
Abstract Passive components embedded in printed circuit boards promise several advantages. In high-s...
The article analyzes the mutual capacitance and inductance of printed circuit and introduces an eval...
In this paper, a new integral equation formulation for via structures is developed for the capacitan...
The via-plate capacitance for a via transition to a multilayer printed circuit board is evaluated an...
In this paper calculations of the capacitance per unit length of one or multilayer dielectric lines ...
In this work we show the influence of the edge-effect on the electric field distribution, and hence ...
Abstract- Embedded capacitance is an alternative to discrete decoupling capacitors and is achieved b...
A simple yet efficient approach is presented to extract the via-plane capacitances for an offset via...
The classical analysis of a plane parallel capacitor gives a capacitance which becomes infinite as t...
The net ground plane inductance of printed circuit boards is the source of common-mode radiated emis...
The partial element equivalent circuit (PEEC) method has proven to be useful for electromagnetic mod...
Interdigitated electrode structures have applications in a myriad of fields and have become attracti...
This letter examines the capacitance of coplanar waveguides (CPWs) in multilayer dielectric substrat...
Shared-antipad via structure is commonly used for high-speed printed circuit board (PCB) design. The...