The substrate roughness has previously set the limit for the minimum thickness of X-ray windows based on technology where planar tungsten grids are used for the membrane support, because the window membrane is built directly onto the substrate. Here this restriction is precluded by using a planarizing layer on the foil combined with retarded etchstop removal, which allows further reduction in the membrane thickness. A polyimide resin has been selected for the planarizing film, which can be removed either by solvents or by plasma etching. The fabrication process presented is capable of producing pressure-enduring X-ray window membranes in large formats down to the membrane polyimide thickness of 250 nm. The fabrication procedures of the wind...
Microfluidics combined with X-ray scattering techniques allows probing conformational changes or ass...
This dissertation presents an investigation of the mechanical, thermal, and physical properties of p...
金沢大学理工研究域機械工学系Ultralow-k (dielectric constant) films are promising substrates for next-generation fl...
The substrate roughness has previously set the limit for the minimum thickness of X-ray windows base...
A technology capable of producing large-area pressure-tolerant x-ray entrance windows of submicromet...
In order to fabricate entrance windows for soft x-ray detectors, various technologies have been deve...
In order to fabricate entrance windows for soft x-ray detectors, various technologies have been deve...
The polyimide-based X-ray windows are evaluated with respect to oxygen-induced erosion with an oxyge...
The x‐ray transmission properties of a very thin polyimide window in the range 7–310 Å have been inv...
The x‐ray transmission properties of a very thin polyimide window in the range 7–310 Å have been inv...
金沢大学理工研究域機械工学系Porous polyimide films are promising insulators for next generation electronic devices...
In deep X-ray lithography (DXRL), synchrotron radiation (SR) is applied to transfer absorber pattern...
Since its invention, polyimide (PI) has been widely used in micro-electro-mechanical system (MEMS) d...
Microfluidics combined with X-ray scattering techniques allows probing conformational changes or ass...
Microfluidics combined with X-ray scattering techniques allows probing conformational changes or ass...
Microfluidics combined with X-ray scattering techniques allows probing conformational changes or ass...
This dissertation presents an investigation of the mechanical, thermal, and physical properties of p...
金沢大学理工研究域機械工学系Ultralow-k (dielectric constant) films are promising substrates for next-generation fl...
The substrate roughness has previously set the limit for the minimum thickness of X-ray windows base...
A technology capable of producing large-area pressure-tolerant x-ray entrance windows of submicromet...
In order to fabricate entrance windows for soft x-ray detectors, various technologies have been deve...
In order to fabricate entrance windows for soft x-ray detectors, various technologies have been deve...
The polyimide-based X-ray windows are evaluated with respect to oxygen-induced erosion with an oxyge...
The x‐ray transmission properties of a very thin polyimide window in the range 7–310 Å have been inv...
The x‐ray transmission properties of a very thin polyimide window in the range 7–310 Å have been inv...
金沢大学理工研究域機械工学系Porous polyimide films are promising insulators for next generation electronic devices...
In deep X-ray lithography (DXRL), synchrotron radiation (SR) is applied to transfer absorber pattern...
Since its invention, polyimide (PI) has been widely used in micro-electro-mechanical system (MEMS) d...
Microfluidics combined with X-ray scattering techniques allows probing conformational changes or ass...
Microfluidics combined with X-ray scattering techniques allows probing conformational changes or ass...
Microfluidics combined with X-ray scattering techniques allows probing conformational changes or ass...
This dissertation presents an investigation of the mechanical, thermal, and physical properties of p...
金沢大学理工研究域機械工学系Ultralow-k (dielectric constant) films are promising substrates for next-generation fl...