A variety of Time Delay and Integration (TDI) arrays have been developed. The TDI image sensor offers significant improvement in performance over a linear CCD-sensor with respect to sensitivity. This is particularly significant in low light level operation since the effective exposure time is increased by a factor which is equal to the number of the TDI stages in the sensor. Our previous work has indicated that the TDI camera can be used with viewing angles up to 30 degrees from the surface normal. The effects caused by vibration of the viewed surface become critical when using a TDI camera at non-zero viewing angles. For this rfeason, a study was made on the vibration effects. This paper reports this study, concentrating on the relation be...
This article describes a specific image quality problem using an UAV and the commercially available ...
Time delay and integration (TDI) charge coupled device (CCD) noise sets a fundamental limit on image...
The digital time delay integration (digital TDI) technology of the complementary metal-oxide-semicon...
A variety of time delay and integration (TDI) arrays have been developed. The TDI image sensor offer...
With Time Delay and Integration (TDI) detector arrays, high resolution space camera systems can be d...
This paper is devoted to description, analysis and practical verification of a new method of CCD li...
Having noted the shortage of specialized reference material concerning the effect of vibration of th...
This paper is devoted to description, analysis and practical verification of a new method of control...
This paper is devoted to description, analysis and practical verification of a new method of control...
Proceedings of SPIE - The International Society for Optical Engineering2921563-570PSIS
Vibration may occur in rotating equipment, for example on the transmission shaft of the gear. If the...
The digital image correlation (DIC) was used in this paper to obtain full-field measurements of a ta...
In order to analyze the impact of multisource vibration on the imaging quality of aerospace optical ...
For fast scanning of large surfaces with microscopic resolution or for scanning of roll-fed material...
The resolution limit of visual sensors due to finite pixel spacing can be overcome by applying conti...
This article describes a specific image quality problem using an UAV and the commercially available ...
Time delay and integration (TDI) charge coupled device (CCD) noise sets a fundamental limit on image...
The digital time delay integration (digital TDI) technology of the complementary metal-oxide-semicon...
A variety of time delay and integration (TDI) arrays have been developed. The TDI image sensor offer...
With Time Delay and Integration (TDI) detector arrays, high resolution space camera systems can be d...
This paper is devoted to description, analysis and practical verification of a new method of CCD li...
Having noted the shortage of specialized reference material concerning the effect of vibration of th...
This paper is devoted to description, analysis and practical verification of a new method of control...
This paper is devoted to description, analysis and practical verification of a new method of control...
Proceedings of SPIE - The International Society for Optical Engineering2921563-570PSIS
Vibration may occur in rotating equipment, for example on the transmission shaft of the gear. If the...
The digital image correlation (DIC) was used in this paper to obtain full-field measurements of a ta...
In order to analyze the impact of multisource vibration on the imaging quality of aerospace optical ...
For fast scanning of large surfaces with microscopic resolution or for scanning of roll-fed material...
The resolution limit of visual sensors due to finite pixel spacing can be overcome by applying conti...
This article describes a specific image quality problem using an UAV and the commercially available ...
Time delay and integration (TDI) charge coupled device (CCD) noise sets a fundamental limit on image...
The digital time delay integration (digital TDI) technology of the complementary metal-oxide-semicon...