102 p.Thesis (Ph.D.)--University of Illinois at Urbana-Champaign, 1998.Interface properties were studied and reaction kinetics characterized in a dielectric/Si/GaAs structure formed by direct nitridation or UV ozone oxidation of a sacrificial pseudomorphic epitaxial Si layer on a GaAs (100) substrate. The nitridation and oxidation process kinetics were studied by X-ray photoelectron spectroscopy (XPS). Thicknesses and compositions were obtained through the quantitative relationships among the relative intensities of different core-level peaks and secondary electron take-off angles in X-ray photoelectron spectra. The nitride thickness was logarithmic with time with formation of ∼14 A near stoichiometric Si3N4 in 10 s. Oxygen contaminatio...
The physical and electrical effects caused by interfacial reactions of HfO2 on Si-passivated GaAs we...
The interfacial structure of silicon/dielectric and silicon/metal systems is particularly amenable t...
This thesis focuses on two aspect of GaAs surface treatment using plasma in order to deposit control...
102 p.Thesis (Ph.D.)--University of Illinois at Urbana-Champaign, 1998.Interface properties were stu...
The etching mechanism of the Si3N4-GaAs(0Ol) interface in CF 4 plasmas is studied by two complementa...
An attempt was made to form a thermally grown SiO2/GaN interface. A Si layer deposited on the c-plan...
Carrier concentrations at a level of ?Z 1 X 1019 cm - 3 were achieved when Si-capped GaAs underwent ...
We report here the improvements in the electrical characteristics of Au/Si<SUB>x</SUB>N<SUB>y</SUB>/...
In this paper, nitridation process of GaAs (1 0 0) substrates was studied in-situ using X-ray photoe...
This thesis concerns the growth mechanisms and the physical and electrical properties of dielectric ...
The incorporation of silicon in GaAs layers grown by metal-organic chemical vapor deposition has bee...
International audienceGaAs(001) substrates nitrided with N 2 plasma at various temperatures were inv...
As for silicon, surface passivation of GaAs and III-V semiconductors using silicon nitride (Si3N4) d...
The removal of native oxide from Si (1 1 1) surfaces was investigated by X-ray photoelectron spectro...
The purpose of the present work was to investigate the carrier concentration and mobility profiles o...
The physical and electrical effects caused by interfacial reactions of HfO2 on Si-passivated GaAs we...
The interfacial structure of silicon/dielectric and silicon/metal systems is particularly amenable t...
This thesis focuses on two aspect of GaAs surface treatment using plasma in order to deposit control...
102 p.Thesis (Ph.D.)--University of Illinois at Urbana-Champaign, 1998.Interface properties were stu...
The etching mechanism of the Si3N4-GaAs(0Ol) interface in CF 4 plasmas is studied by two complementa...
An attempt was made to form a thermally grown SiO2/GaN interface. A Si layer deposited on the c-plan...
Carrier concentrations at a level of ?Z 1 X 1019 cm - 3 were achieved when Si-capped GaAs underwent ...
We report here the improvements in the electrical characteristics of Au/Si<SUB>x</SUB>N<SUB>y</SUB>/...
In this paper, nitridation process of GaAs (1 0 0) substrates was studied in-situ using X-ray photoe...
This thesis concerns the growth mechanisms and the physical and electrical properties of dielectric ...
The incorporation of silicon in GaAs layers grown by metal-organic chemical vapor deposition has bee...
International audienceGaAs(001) substrates nitrided with N 2 plasma at various temperatures were inv...
As for silicon, surface passivation of GaAs and III-V semiconductors using silicon nitride (Si3N4) d...
The removal of native oxide from Si (1 1 1) surfaces was investigated by X-ray photoelectron spectro...
The purpose of the present work was to investigate the carrier concentration and mobility profiles o...
The physical and electrical effects caused by interfacial reactions of HfO2 on Si-passivated GaAs we...
The interfacial structure of silicon/dielectric and silicon/metal systems is particularly amenable t...
This thesis focuses on two aspect of GaAs surface treatment using plasma in order to deposit control...