Design of Improved Polyester Dielectric Insulators for Electronic Packaging

160 p.Thesis (Ph.D.)--University of Illinois at Urbana-Champaign, 1998.First, the foaming methods used to lower the dielectric constant of the copolyester thermoset to 2.5 $\rm (25\sp\circ C,$ 1 kHz) are described. Second, the nature of the increase in melting temperature of the liquid crystalline copolyesters upon annealing near their original melting temperature to improve the dimensional stability is elucidated. Lastly, a description of a new photosensitive copolyester dielectric insulator is presented.U of I OnlyRestricted to the U of I community idenfinitely during batch ingest of legacy ETD