91 p.Thesis (Ph.D.)--University of Illinois at Urbana-Champaign, 2008.Within-die process variation causes individual cores in a Chip Multiprocessor (CMP) to differ substantially in both static power consumed and maximum frequency supported. In this environment, ignoring variation effects when scheduling applications or when managing power with Dynamic Voltage and Frequency Scaling (DVFS) is suboptimal. This thesis presents a set of variation-aware algorithms for application scheduling and power management. One such power management algorithm, uses linear programming to find the best voltage and frequency levels for each of the cores in the CMP---maximizing throughput at a given power budget.U of I OnlyRestricted to the U of I community iden...
The parallel nature of process execution on chip multiprocessors (CMPs) has considerably boosted lev...
With scaling of semiconductor fabrication technologies and the push towards deep sub-micron technolo...
Thesis (Ph. D.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer...
91 p.Thesis (Ph.D.)--University of Illinois at Urbana-Champaign, 2008.Within-die process variation c...
Faced with the challenge of finding ways to use an ever-growing transistor budget, microarchitects h...
Within-die variation in leakage power consumption is sub-stantial and increasing for chip-level mult...
2011-11-22In today’s IC design, one of the key challenges is the increase in power consumption of th...
sors (TLR-CMP) is efficient for soft error tolerance. Process variation causes core-to-core (C2C) pe...
Continued technology scaling has enabled the tremendous growth that semi-conductor industry has witn...
In nanometer technology regime, process variation (PV) causes uncertainties in the processor frequen...
Abstract – Chip-Multi-Processors (CMP) utilize multiple energy-efficient Processing Elements (PEs) t...
Parameter variations, which are increasing along with advances in process technologies, affect both...
Abstract – Chip-Multi-Processors (CMP) utilize multiple energy-efficient Processing Elements (PEs) t...
Abstract – In contemporary semiconductor technologies, considerable unpredictability in the behavior...
142 p.Thesis (Ph.D.)--University of Illinois at Urbana-Champaign, 2007.Using this model we introduce...
The parallel nature of process execution on chip multiprocessors (CMPs) has considerably boosted lev...
With scaling of semiconductor fabrication technologies and the push towards deep sub-micron technolo...
Thesis (Ph. D.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer...
91 p.Thesis (Ph.D.)--University of Illinois at Urbana-Champaign, 2008.Within-die process variation c...
Faced with the challenge of finding ways to use an ever-growing transistor budget, microarchitects h...
Within-die variation in leakage power consumption is sub-stantial and increasing for chip-level mult...
2011-11-22In today’s IC design, one of the key challenges is the increase in power consumption of th...
sors (TLR-CMP) is efficient for soft error tolerance. Process variation causes core-to-core (C2C) pe...
Continued technology scaling has enabled the tremendous growth that semi-conductor industry has witn...
In nanometer technology regime, process variation (PV) causes uncertainties in the processor frequen...
Abstract – Chip-Multi-Processors (CMP) utilize multiple energy-efficient Processing Elements (PEs) t...
Parameter variations, which are increasing along with advances in process technologies, affect both...
Abstract – Chip-Multi-Processors (CMP) utilize multiple energy-efficient Processing Elements (PEs) t...
Abstract – In contemporary semiconductor technologies, considerable unpredictability in the behavior...
142 p.Thesis (Ph.D.)--University of Illinois at Urbana-Champaign, 2007.Using this model we introduce...
The parallel nature of process execution on chip multiprocessors (CMPs) has considerably boosted lev...
With scaling of semiconductor fabrication technologies and the push towards deep sub-micron technolo...
Thesis (Ph. D.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer...