Generation-Annealing of Interface Traps and Hydrogenation of Boron Acceptors in Metal-Oxide-Silicon Capacitors Irradiated by Kilo-Volt Electrons

117 p.Thesis (Ph.D.)--University of Illinois at Urbana-Champaign, 1987.Generation and annealing of interface traps and deactivation of boron acceptors in silicon are investigated in Al/SiO$\sb2$/Si capacitors exposed to 8 keV electrons. Post-oxidation conditions are varied. Interface and oxide traps are separated using a repeated stress-anneal technique with the time-dependent high-frequency capacitance-voltage measurements.Two interface trap species were detected in all capacitors. Boron hydrogenation proceeds rapidly during irradiation but continues for many hours after the 8 keV electron beam is removed. Higher trap generation rate, trap density and boron deactivation percentage were observed during irradiation in the oxide subjected to DI water rinse, no post-oxidation anneal (in Argon), or no post-metallization anneal (in forming gas). Results suggest that the two traps are due to intrinsic dangling bonds initially hydrogenated (Si-H or O-H) or strained (Si-O). The hydrogen bond model is further supported by a one-to-one experimental correlation between the annealing or hydrogenation of the interface traps and the hydrogenation of the boron acceptors.U of I OnlyRestricted to the U of I community idenfinitely during batch ingest of legacy ETD