199 p.Thesis (Ph.D.)--University of Illinois at Urbana-Champaign, 1983.The increased complexity of the very large scale integrated circuits (VLSI) has greatly impacted the field of computer-aided design (CAD). One of the problems brought about is the interconnection problem.In this research, the goal is twofold. First of all, a more accurate numerical method to evaluate the interconnect capacitance, including the coupling capacitance between interconnects and the fringing field capacitance, was investigated, and the integral method was employed. Two FORTRAN programs "CAP2D" and "CAP3D" based on this method were developed. Second, a PASCAL extraction program emphasizing the extraction of interconnect parameters was develo...
An integral equation formulation for the calculation of the capacitance of three-dimensional VLSI ge...
A computer-efficient algorithm to determine the parasitic capacitances and inductances associated wi...
VLSI interconnect capacitance is becoming more significant and also increasingly subject to process v...
technical reportA novel approach to solving the accurate capacitance and resistance extraction probl...
With aggressive technology scaling, the accurate and efficient modeling and simulation of interconne...
163 p.Thesis (Ph.D.)--University of Illinois at Urbana-Champaign, 1987.As the feature sizes of Very-...
For submicron integrated circuits, 3D numerical techniques are required to accu-rately compute the v...
Interconnects are an important constituent of any large scale integrated circuit, and accurate inter...
[[abstract]]This paper presents a new paradigm for fast and accurate 2-D and 3-D interconnect capaci...
Interconnects are an important constituent of any large scale integrated circuit, and accurate inter...
This paper introduces a set of analytical formulations for 3D modelling of inter-layer capacitances....
Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, p...
INTRODUCTION With the decrease of feature sizes and the increase of chip dimensions in integrated c...
Abstract—A floating random walk (FRW) solver, called RWCap, is presented for the capacitance extract...
Single-level and multi-path interconnect structures embedded in dielectrics on a silicon substrate a...
An integral equation formulation for the calculation of the capacitance of three-dimensional VLSI ge...
A computer-efficient algorithm to determine the parasitic capacitances and inductances associated wi...
VLSI interconnect capacitance is becoming more significant and also increasingly subject to process v...
technical reportA novel approach to solving the accurate capacitance and resistance extraction probl...
With aggressive technology scaling, the accurate and efficient modeling and simulation of interconne...
163 p.Thesis (Ph.D.)--University of Illinois at Urbana-Champaign, 1987.As the feature sizes of Very-...
For submicron integrated circuits, 3D numerical techniques are required to accu-rately compute the v...
Interconnects are an important constituent of any large scale integrated circuit, and accurate inter...
[[abstract]]This paper presents a new paradigm for fast and accurate 2-D and 3-D interconnect capaci...
Interconnects are an important constituent of any large scale integrated circuit, and accurate inter...
This paper introduces a set of analytical formulations for 3D modelling of inter-layer capacitances....
Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, p...
INTRODUCTION With the decrease of feature sizes and the increase of chip dimensions in integrated c...
Abstract—A floating random walk (FRW) solver, called RWCap, is presented for the capacitance extract...
Single-level and multi-path interconnect structures embedded in dielectrics on a silicon substrate a...
An integral equation formulation for the calculation of the capacitance of three-dimensional VLSI ge...
A computer-efficient algorithm to determine the parasitic capacitances and inductances associated wi...
VLSI interconnect capacitance is becoming more significant and also increasingly subject to process v...